TSM-127-02-S-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-127-02-S-DH-A-K-TR is a 54-position, 0.100" pitch surface mount terminal strip connector. It features dual-row through-hole compatible surface mount design. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 54
- Lifecycle
- ACTIVE
- Datasheet
- TSM-127-02-S-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 54 positions in dual-row 0.100" pitch configuration for high-density board connections
- Surface mount (SMT) design enables automated PCB assembly with reflow soldering compatibility
- Gold-plated contacts provide superior corrosion resistance and reliable signal integrity across extended service life
Applications
The TSM-127-02-S-DH-A-K-TR is ideal for high-density PCB interconnect applications in communications equipment, industrial control systems, and test instrumentation. Its 0.100" pitch dual-row configuration suits backplane connectors, daughter card interfaces, and modular electronic assemblies requiring robust, space-efficient signal routing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-127-02-S-DH-A-K-TR have and what is its pitch?
The TSM-127-02-S-DH-A-K-TR features 54 positions arranged in a dual-row configuration with a 0.100" (2.54 mm) pitch. This standard pitch spacing ensures compatibility with a wide range of mating connectors and PCB land patterns used in industrial and commercial electronics.
What assembly method is required for the TSM-127-02-S-DH-A-K-TR and how does this affect PCB design?
The TSM-127-02-S-DH-A-K-TR uses surface mount technology (SMT), allowing placement via pick-and-place equipment and reflow soldering. The SMT footprint requires precise pad geometry on the PCB, and the dual-row 0.100" pitch pattern must be matched to a 54-pin land pattern for reliable solder joints.
In which industrial or commercial applications is the TSM-127-02-S-DH-A-K-TR commonly deployed?
This connector is commonly used in backplane systems, test and measurement instrumentation, communications hardware, and embedded computing modules. Its 54-position, dual-row layout with 0.100" pitch makes it suitable for daughter card interfaces and high-density signal routing in rack-mount or board-level assemblies.
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