TSM-127-02-L-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-127-02-L-DH-A-P-TR is a 54-position dual-row surface mount terminal strip with .100" pitch and low-profile body, providing reliable SMT board-to-board connections in height-constrained designs. Gold-plated contacts and tape-and-reel packaging support high-volume automated PCB assembly. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 54
- Lifecycle
- ACTIVE
- Datasheet
- TSM-127-02-L-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 54 positions dual-row on 2.54 mm (.100") pitch for mid-density SMT board-to-board connectivity
- Low-profile (L) body minimizes total stack height for space-constrained PCB designs
- Gold-plated contacts ensure low contact resistance and long mating cycle reliability
- Tape-and-reel (TR) packaging for seamless integration into automated pick-and-place assembly
- Compatible with SAMTEC .100" pitch SSQ and SFM mating socket families
Applications
TSM-127-02-L-DH-A-P-TR is widely deployed in embedded computing modules, data acquisition boards, and telecommunications line cards where low board stack height is a design constraint. The 54-position dual-row SMT footprint supports parallel data buses, multi-channel analog interfaces, and general-purpose I/O expansion in commercial and industrial electronic systems.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the low-profile (L) body of TSM-127-02-L-DH-A-P-TR reduce overall board stack height compared to standard TSM variants?
The low-profile L body of TSM-127-02-L-DH-A-P-TR reduces the unmated connector height by approximately 1 mm to 2 mm versus standard-height TSM variants, allowing total mated stack heights as compact as 8.5 mm. This is significant in slim form-factor designs such as embedded SBCs or blade server cards where every millimeter of vertical clearance is critical.
Which signal count and pitch make TSM-127-02-L-DH-A-P-TR suitable for parallel bus interfaces in mid-density PCB designs?
TSM-127-02-L-DH-A-P-TR provides 54 signal positions arranged in a dual-row 2.54 mm (.100") pitch layout, supporting parallel buses up to 27 bits wide per row or mixed-signal interfaces. This pin count comfortably accommodates 32-bit parallel data buses plus power, ground, and control signals in a single connector, reducing interconnect complexity.
For procurement planning, what packaging quantity and lead time apply to TSM-127-02-L-DH-A-P-TR?
The -TR suffix confirms tape-and-reel packaging, typically supplied in reels of 500 to 1000 units per reel for this 54-pin body size. SAMTEC standard catalog lead times are generally 1 to 2 weeks for most TSM series variants. Buyers requiring quantities above 5000 units should confirm reel inventory with their distributor to avoid production scheduling delays.
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