TSM-127-02-FM-SH-A SAMTEC Connector (Other) In Stock
The TSM-127-02-FM-SH-A is a 27-position dual-row SAMTEC surface-mount terminal strip with 2.54 mm (0.100 inch) pitch and horizontal single-row orientation, featuring female-male contacts and shrouded housing for reliable PCB-to-board or wire-to-board signal interconnection. Designed for industrial and instrumentation PCBs requiring high-density SMT connectivity with mechanical keying.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 27
- Lifecycle
- ACTIVE
- Datasheet
- TSM-127-02-FM-SH-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 27-position dual-row layout at 2.54 mm (0.100 inch) pitch delivers high contact density in a compact surface-mount terminal strip footprint
- Shrouded housing provides mechanical keying and contact protection to prevent mis-mating across 27 signal pins in dense board assemblies
- Horizontal single-row orientation enables low-profile board-edge mating with ribbon cable or daughter-card connectors
- Surface-mount termination supports automated SMT reflow assembly for consistent solder joint quality in high-volume production
Applications
The TSM-127-02-FM-SH-A is used in industrial control systems, test and measurement instruments, and embedded computing platforms that require a 27-position shrouded dual-row 0.100 inch pitch SMT header for reliable signal routing between PCBs or between a PCB and a cable harness. Its horizontal orientation and shrouded female-male contact design suit panel-mount applications and daughterboard assemblies where low-profile, keyed interconnection simplifies field wiring and prevents assembly errors during production or maintenance.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does the TSM-127-02-FM-SH-A provide, and how is the dual-row layout arranged at 2.54 mm pitch?
The TSM-127-02-FM-SH-A provides 27 positions in a dual-row configuration at 2.54 mm (0.100 inch) pitch, with 14 pins in one row and 13 pins in the adjacent row to achieve the odd total count, all within a surface-mount terminal strip body compatible with standard 0.100 inch PCB footprint libraries. This layout is common in embedded bus interfaces and industrial I/O expansion headers where an odd number of signals, such as 25 data lines plus 2 power or ground pins, must route through a single compact dual-row connector.
What PCB assembly process is compatible with the TSM-127-02-FM-SH-A, and how does horizontal orientation affect component height above the board?
The TSM-127-02-FM-SH-A is a surface-mount component processed through standard SMT pick-and-place and lead-free reflow soldering at peak temperatures up to approximately 260°C, using solder paste on standard 2.54 mm pitch SMT pads. The horizontal single-row orientation means the connector body lies parallel to the PCB surface, keeping the mating interface at the board edge and limiting the connector's height above the PCB to typically less than 8 mm to 10 mm, which is significantly lower than a vertical through-hole header of equivalent pitch and position count that would extend 10 mm to 15 mm above the board.
How does the shrouded housing of the TSM-127-02-FM-SH-A improve wiring reliability compared to an open-pin dual-row SMT header in a 27-position harness connection?
The integrated shroud of the TSM-127-02-FM-SH-A mechanically guides and locks the mating cable connector across all 27 positions, preventing the partial-insertion and 180-degree mis-mating errors that commonly occur with open-pin 0.100 inch dual-row headers when assembling multi-signal ribbon cable harnesses under time pressure in production or field environments. The shroud also shields the 27 dual-row contacts from PCB cleaning solvents, conformal coating overspray, and mechanical contact with adjacent board components during assembly, preserving contact integrity and reducing rework rates in high-volume industrial manufacturing.
When is TSM-127-02-FM-SH-A preferred over a through-hole equivalent for a mid-volume industrial I/O board where both SMT and through-hole processes are available?
The TSM-127-02-FM-SH-A surface-mount design is preferred over a through-hole equivalent when the board is assembled entirely on one SMT line, since mixing through-hole components into an otherwise SMT board requires an additional wave-solder or selective-solder pass that adds processing time of roughly 30 to 60 seconds per board plus equipment changeover overhead. For volumes of 500 to 5,000 industrial I/O boards per month, eliminating the wave-solder step by using the SMT TSM-127-02-FM-SH-A reduces total assembly cost per unit and simplifies process control, while the 27-position shrouded connector still provides the same cable mating reliability as its through-hole counterpart.
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