TSM-126-03-TM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-126-03-TM-DH-A-K-TR is a 52-position dual-row surface-mount terminal strip with 0.100" (2.54 mm) pitch, offering rugged SMT board connectivity for high-pin-count applications in industrial and embedded electronics. Designed for automated tape-and-reel assembly with a compact SMT footprint supporting 26 pins per row. Available from global authorized distributors with competitive pricing and fast worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 52
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-126-03-TM-DH-A-K-TR?
- 52-position dual-row terminal strip at 0.100" (2.54 mm) pitch providing industry-standard grid compatibility for broad mating connector selection
- Surface-mount SMT design enables low-profile board assembly and automated reflow soldering for high-volume production
- Tape-and-reel (TR) packaging supports high-throughput automated pick-and-place manufacturing with consistent placement accuracy
- Dual-row DH (dual height) configuration accommodates power and signal contacts in a compact, high-density board area
What is TSM-126-03-TM-DH-A-K-TR used for?
The TSM-126-03-TM-DH-A-K-TR is designed for high-pin-count surface-mount interconnect applications in industrial controllers, embedded computing boards, and test-and-measurement equipment requiring 52 positions at the standard 0.100" pitch. Its dual-row layout is widely used in development boards, expansion modules, and backplane daughter-card interfaces where a large number of signal lines must be routed in a minimal PCB area. The tape-and-reel packaging makes this terminal strip particularly suited for automated SMT assembly lines in consumer electronics, communications hardware, and IoT gateway products.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-126-03-TM-DH-A-K-TR datasheet?
TSM-126-03-TM-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-126-03-TM-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does the TSM-126-03-TM-DH-A-K-TR support and how are they arranged?
The TSM-126-03-TM-DH-A-K-TR supports 52 positions arranged in a dual-row configuration with 26 pins per row and a standard 0.100" (2.54 mm) pitch. This industry-standard spacing provides broad compatibility with mating male headers and connectors, and allows up to 52 independent signal or power connections in a compact SMT footprint that is less than 2.6 inches long.
Which development board and expansion module designs benefit from TSM-126-03-TM-DH-A-K-TR?
Development boards, SBC (single-board computer) expansion headers, and PCIe mezzanine modules benefit most from this 52-position dual-row SMT terminal strip at 0.100" pitch. Its standard 2.54 mm grid matches GPIO expansion connectors on platforms like Raspberry Pi HATs, Arduino shields, and industrial PLC I/O modules, providing backward compatibility with decades of standardized 0.100" connector ecosystems while enabling modern SMT manufacturing.
What assembly advantages does the tape-and-reel format provide for TSM-126-03-TM-DH-A-K-TR in volume production?
Tape-and-reel (TR) packaging allows automated pick-and-place machines to place the TSM-126-03-TM-DH-A-K-TR at rates of hundreds of placements per hour with positional accuracy within ±0.05 mm. This format reduces manual handling errors and supports reel quantities of up to 500 pieces, making it cost-effective for production runs of 1000 or more boards. Reflow soldering compatibility eliminates the need for wave solder or manual assembly, reducing per-unit assembly cost by up to 40%.
Can TSM-126-03-TM-DH-A-K-TR be used as an alternative to through-hole dual-row headers in redesigned PCBs?
Yes, the TSM-126-03-TM-DH-A-K-TR can replace through-hole dual-row headers in PCB redesigns when migrating to surface-mount assembly. It maintains the same 0.100" (2.54 mm) pitch and 52-position count, preserving signal routing compatibility. The SMT footprint reduces PCB drilling requirements and supports thinner board designs under 1.6 mm, while eliminating through-hole barrel plating costs—a key advantage when transitioning to high-density multilayer PCB processes.
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