TSM-126-03-STL-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-126-03-STL-DH-A-K-TR is a 52-position, 0.100-inch pitch dual-row surface mount terminal strip connector with surface mount tails, designed for reliable PCB-to-board interconnects in compact electronic assemblies.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 52
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-126-03-STL-DH-A-K-TR?
- 52-position dual-row configuration with 0.100-inch (2.54 mm) pitch for high-density board connections
- Surface mount tail termination enables reflow soldering for automated PCB assembly
- Gold-plated contacts ensure low contact resistance and long-term corrosion resistance in demanding environments
What is TSM-126-03-STL-DH-A-K-TR used for?
The TSM-126-03-STL-DH-A-K-TR is ideal for high-density board-to-board interconnects in industrial control systems, test and measurement equipment, and embedded computing platforms. Its 52-position dual-row layout suits applications requiring many signal lines in a compact footprint, such as FPGA daughter cards, backplane modules, and data acquisition boards.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-126-03-STL-DH-A-K-TR datasheet?
TSM-126-03-STL-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-126-03-STL-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch does the TSM-126-03-STL-DH-A-K-TR support?
The TSM-126-03-STL-DH-A-K-TR features 52 positions arranged in a dual-row layout with a 0.100-inch (2.54 mm) pitch, providing a high pin count in a compact surface mount footprint suitable for dense PCB designs.
Which PCB assembly processes are compatible with the TSM-126-03-STL-DH-A-K-TR termination style?
This connector uses surface mount tails, making it fully compatible with standard reflow soldering processes at temperatures up to 260°C, enabling seamless integration into automated SMT assembly lines without manual through-hole soldering.
In what embedded computing or test equipment applications is the TSM-126-03-STL-DH-A-K-TR typically used?
The TSM-126-03-STL-DH-A-K-TR is commonly used in FPGA development boards, industrial backplane systems, and modular test equipment where 52 signal lines must be routed between boards at a reliable 0.100-inch pitch with low insertion loss.
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