TSM-126-03-LM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-126-03-LM-DH-A-K-TR is a 52-position dual-row surface-mount terminal strip with 0.100-inch (2.54 mm) pitch featuring a low-mount (LM) profile for reduced assembly height. Rated at 3 A per pin with tape-and-reel packaging, it is optimized for automated SMT production in industrial and embedded applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 52
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-126-03-LM-DH-A-K-TR?
- 52-position dual-row layout at 0.100-inch (2.54 mm) pitch for comprehensive I/O and power board interconnects
- Low-mount (LM) profile reduces overall PCB assembly height for chassis-constrained embedded system designs
- 3 A per pin current rating enabling simultaneous routing of signal lines and low-voltage power rails
- Tape-and-reel (TR) packaging supporting high-volume automated SMT pick-and-place production processes
What is TSM-126-03-LM-DH-A-K-TR used for?
The TSM-126-03-LM-DH-A-K-TR is designed for compact embedded computing platforms, industrial I/O expansion boards, and backplane interconnects where a 52-position dual-row connector must fit within strict height constraints. The low-mount profile makes it especially valuable in chassis-enclosed systems and rack-mount equipment where vertical clearance between PCBs is limited to under 8 mm. Its tape-and-reel format and surface-mount termination at 2.54 mm pitch streamline integration into automated PCB assembly lines for medium-to-high volume production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-126-03-LM-DH-A-K-TR datasheet?
TSM-126-03-LM-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-126-03-LM-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What height advantage does the low-mount (LM) profile of the TSM-126-03-LM-DH-A-K-TR provide in stacked PCB designs?
The LM (low-mount) designation reduces the above-board connector height compared to standard TSM-126 variants, allowing a mated stack height typically in the 5 mm to 7 mm range. This is critical for multi-board assemblies in rack-mount servers, embedded modules, and industrial controllers where PCB-to-PCB clearance is constrained to less than 10 mm.
How does the 52-position TSM-126-03-LM-DH-A-K-TR serve industrial I/O expansion boards differently than a 30-position TSM-115 connector?
The TSM-126-03-LM-DH-A-K-TR provides 52 positions versus 30 in the TSM-115, accommodating over 70% more signal or power lines at the same 0.100-inch (2.54 mm) pitch. Industrial I/O expansion boards integrating digital inputs, analog channels at 0-10 V, and RS-485 or CAN bus signals simultaneously benefit from the higher pin count without needing a second connector or non-standard pitch.
What current per pin does the TSM-126-03-LM-DH-A-K-TR support across its 52 positions?
Each of the 52 pins supports up to 3 A continuous current, for a combined capacity of 156 A across all positions. In practice, power pins typically carry 3 A at 3.3 V, 5 V, or 12 V rails, while signal pins operate at under 0.5 A, allowing flexible mixed-use assignment of positions in backplane and expansion board designs.
Is the TSM-126-03-LM-DH-A-K-TR available in tape-and-reel for automated SMT assembly, and what reflow temperature does it tolerate?
Yes, the -TR suffix confirms tape-and-reel packaging for automated pick-and-place SMT assembly. The connector withstands lead-free reflow solder profiles with peak temperatures up to 260°C, and its 0.100-inch (2.54 mm) pitch surface-mount pads conform to IPC-7351 land pattern standards for repeatable, high-yield solder joint formation in volume production.
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