TSM-126-03-F-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-126-03-F-DH-A-K-TR is a 52-position surface-mount terminal strip with 0.100-inch (2.54 mm) pitch in a dual-row through-hole compatible package with tape-and-reel packaging for automated assembly. It supports dense board interconnects with reliable solder termination. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 52
- Lifecycle
- ACTIVE
- Datasheet
- TSM-126-03-F-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 52-position dual-row terminal strip on 0.100-inch (2.54 mm) pitch, compatible with standard 0.100-inch grid PCB layouts
- Surface-mount termination style allows SMT reflow assembly while retaining a through-hole-compatible footprint
- Tape-and-reel (TR) packaging enables automated pick-and-place assembly for high-volume production
- Dual-row configuration maximizes signal density within a compact PCB area
Applications
The TSM-126-03-F-DH-A-K-TR is suited for backplane, motherboard, and daughtercard interconnect applications in industrial automation, embedded computing, and test equipment. Its 52-position dual-row format on 0.100-inch pitch supports both parallel data buses and mixed-signal interfaces requiring a standard pin grid footprint. The tape-and-reel packaging makes it particularly attractive for high-volume SMT production lines seeking consistent placement accuracy.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the TSM-126-03-F-DH-A-K-TR provide?
The TSM-126-03-F-DH-A-K-TR offers 52 positions arranged in a dual-row configuration on a standard 0.100-inch (2.54 mm) pitch. This layout allows designers to interface with legacy 0.100-inch grid PCB footprints while using surface-mount assembly techniques for streamlined manufacturing.
Why choose the tape-and-reel version (TR) of the TSM-126-03-F-DH-A-K-TR for production?
The tape-and-reel (TR) packaging enables automated pick-and-place assembly, significantly improving placement accuracy and throughput compared to loose or tube-packaged connectors. For production runs requiring hundreds or thousands of units, the TR format reduces handling time, minimizes placement errors, and is compatible with standard SMT assembly equipment running at speeds exceeding 10,000 components per hour.
Which board-to-board interface designs benefit most from the TSM-126-03-F-DH-A-K-TR?
Backplane and daughterboard designs benefit most from the TSM-126-03-F-DH-A-K-TR, especially where 52 signal or power connections are needed on a 0.100-inch grid. The dual-row layout supports 26 differential pairs or 52 single-ended signals, making it appropriate for industrial PLC expansion buses and embedded compute mezzanine interfaces.
How does the TSM-126-03-F-DH-A-K-TR's 0.100-inch pitch compare to finer-pitch alternatives for connector density?
At 0.100-inch (2.54 mm) pitch, the TSM-126-03-F-DH-A-K-TR is less dense than 0.050-inch pitch connectors but offers easier PCB layout tolerances and lower-cost PCB fabrication. A 52-position count at 0.100-inch pitch spans approximately 1.3 inches in board length per row, which is manageable on most standard PCB designs without requiring HDI (high-density interconnect) layer stackups.
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