TSM-126-02-TM-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-126-02-TM-DH-A-P-TR is a 52-position dual-row surface-mount terminal strip with 2.54 mm (0.100") pitch and top-mount footprint, enabling reliable high-density PCB signal routing in computing, instrumentation, and industrial systems.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 52
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 52 positions (26 per row) dual-row layout on standard 2.54 mm pitch grid
- Top-mount (TM) footprint style for direct SMT placement on PCB surface
- Gold-plated (A) contacts for low contact resistance and long-term reliability
- Tape-and-reel (TR) packaging for efficient automated pick-and-place assembly
- Dual-row (DH) design maximizes signal density per unit of board length
Applications
TSM-126-02-TM-DH-A-P-TR is designed for board-to-board interconnection in embedded computing modules, FPGA carrier boards, and test and measurement platforms where 52 signal positions must be reliably connected in a compact SMT footprint. Its gold-plated contacts and top-mount orientation support repeated mating cycles, making it a suitable choice for development kits and field-replaceable expansion modules.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many differential pairs can TSM-126-02-TM-DH-A-P-TR accommodate for LVDS signal routing?
With 52 total positions in a dual-row 2.54 mm pitch layout, TSM-126-02-TM-DH-A-P-TR can route up to 26 differential pairs if all contacts are assigned to LVDS signals. In practice, designers typically reserve 4 to 8 contacts for power and ground, leaving 22 to 24 differential pairs for high-speed data lanes.
Why choose gold-plated contacts in TSM-126-02-TM-DH-A-P-TR for a development board used in repeated prototyping?
Gold-plated contacts maintain low contact resistance below 20 mΩ even after hundreds of mating cycles, making TSM-126-02-TM-DH-A-P-TR well suited for development boards that are frequently connected and disconnected during firmware iteration. Gold also resists oxidation, ensuring reliable 3.3 V or 5 V logic signal integrity over the life of the prototype.
For a 52-position SMT connector order, does the tape-and-reel format of TSM-126-02-TM-DH-A-P-TR offer cost advantages at mid-volume quantities?
Tape-and-reel packaging reduces manual handling per unit at quantities of 500 or more, lowering SMT assembly labor cost compared to tube-packed connectors. For mid-volume production runs of 1000 to 5000 boards, TSM-126-02-TM-DH-A-P-TR in reel format eliminates the per-piece placement overhead and allows the pick-and-place machine to load the 52-position connector in a single automated step.
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