TSM-126-02-T-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-126-02-T-DH-A-K-TR is a 52-position, dual-row, .100" pitch surface mount terminal strip with locking mechanism and tape-and-reel packaging. Gold-plated contacts deliver low contact resistance for high-signal-count board interconnects. Available in stock globally with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 52
- Lifecycle
- ACTIVE
- Datasheet
- TSM-126-02-T-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-126-02-T-DH-A-K-TR?
- 52-position dual-row .100" pitch layout provides the highest contact density in the TSM standard surface mount series
- Locking retention mechanism (K suffix) secures mated connectors against vibration and accidental disconnection
- Tape-and-reel (TR) packaging enables continuous automated SMT pick-and-place at production line speeds
- Gold over nickel contact plating ensures consistent low contact resistance and long service life across mating cycles
What is TSM-126-02-T-DH-A-K-TR used for?
The TSM-126-02-T-DH-A-K-TR is suited for high-pin-count board-to-board interconnects in server backplanes, industrial PLCs, and medical imaging electronics that require 52 reliable signal paths in a single SMT connector. The locking mechanism makes it appropriate for rack equipment subject to vibration or repeated board insertion. Tape-and-reel packaging supports high-volume contract manufacturing operations.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-126-02-T-DH-A-K-TR datasheet?
TSM-126-02-T-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-126-02-T-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Why would a server backplane designer choose the 52-position TSM-126-02-T-DH-A-K-TR over two separate 26-position connectors?
Using a single 52-position TSM-126-02-T-DH-A-K-TR eliminates the alignment complexity and board space overhead of two separate 26-position connectors. A single connector guarantees simultaneous mating of all 52 contacts, reducing insertion force variability. The locking mechanism (K suffix) on the 52-pin version also provides a single retention point, simplifying mechanical design in high-density server blade or backplane assemblies where connector spacing is under 0.100" constraints.
What does the A suffix indicate on the TSM-126-02-T-DH-A-K-TR and how does it affect assembly?
The A suffix on the TSM-126-02-T-DH-A-K-TR typically denotes an additional alignment or assembly feature specific to SAMTEC's TSM series, such as an SMT anchor foot or alignment post. This feature holds the connector in position on the PCB during reflow soldering before the solder joints are formed, reducing tombstoning and misalignment on the 52-position body. It improves first-pass yield on automated SMT lines where the connector's weight could cause shifting during the reflow oven profile.
For a medical imaging board requiring 52 signal lines, how does the locking feature of this connector reduce maintenance risk?
Medical imaging boards are serviced by trained technicians who may need to disconnect and reconnect the board multiple times during calibration. The locking mechanism (K suffix) on the TSM-126-02-T-DH-A-K-TR requires deliberate release before unmating, preventing partial disconnection of any of the 52 signals during board handling. This reduces the risk of single-contact failures that could corrupt image data or trigger diagnostic errors in critical medical equipment.
How does the .100" pitch of the TSM-126-02-T-DH-A-K-TR limit or enable routing on a 4-layer PCB?
At .100" (2.54 mm) pitch with a dual-row 52-position layout, the TSM-126-02-T-DH-A-K-TR provides sufficient pad-to-pad clearance for standard 6 mil trace routing between pads on a 4-layer PCB. A 52-position dual-row connector at this pitch spans approximately 1.3 inches in length, requiring a via escape strategy on inner layers for high-speed signals. Compared to 0.050" pitch alternatives, the .100" pitch significantly reduces HDI requirements.
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