TSM-126-02-F-DH-A-K-TR SAMTEC Connector (Other) In Stock
TSM-126-02-F-DH-A-K-TR is a 52-position dual-row surface mount terminal strip from SAMTEC with 2.54 mm (0.100") pitch, dual-height housing option, and tape-and-reel packaging for automated SMT assembly. It features flat (F) contact style and anti-wicking (A) treatment to ensure reliable solder joint formation in high-volume production. This connector targets embedded system backplanes, FPGA daughter cards, and industrial control boards requiring secure, dense 52-circuit board-to-board SMT interconnects.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 52
- Lifecycle
- ACTIVE
- Datasheet
- TSM-126-02-F-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-126-02-F-DH-A-K-TR?
- 52-position dual-row configuration provides high pin count at 2.54 mm pitch in a compact SMT footprint
- Flat (F) contact style optimizes coplanarity for consistent solder joint formation across all 52 positions
- Anti-wicking (A) contact treatment prevents solder flow into the connector housing during reflow, maintaining contact integrity
- Dual-height (DH) housing option accommodates varying board-to-board stack heights in multi-board assemblies
- Tape-and-reel (TR) packaging enables high-volume automated pick-and-place SMT assembly
What is TSM-126-02-F-DH-A-K-TR used for?
The TSM-126-02-F-DH-A-K-TR suits embedded computing modules, FPGA daughter cards, and industrial I/O backplanes where a 52-circuit dual-row SMT connector at 2.54 mm pitch is needed for board-to-board signal interconnection. Its anti-wicking and flat-contact design make it reliable in high-volume production environments running standard SMT reflow profiles up to 260°C. The dual-height housing option provides additional flexibility for mezzanine card designs that require varying standoff heights between the main board and the attached module.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-126-02-F-DH-A-K-TR datasheet?
TSM-126-02-F-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-126-02-F-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does TSM-126-02-F-DH-A-K-TR have and what pitch separates each contact?
The TSM-126-02-F-DH-A-K-TR is a 52-position, dual-row surface mount terminal strip with contacts on a 2.54 mm (0.100") center-to-center pitch. The dual-row layout places 26 contacts per row, providing a total of 52 signal or power circuits in a connector body approximately 33 mm long, suitable for dense board-to-board signal routing in embedded systems.
What does the anti-wicking (A) contact treatment in TSM-126-02-F-DH-A-K-TR prevent during SMT reflow?
The anti-wicking treatment on TSM-126-02-F-DH-A-K-TR contacts prevents molten solder from flowing up the contact tails into the connector housing during reflow soldering at temperatures up to 260°C. Without this treatment, solder wicking can bridge contacts inside the housing, causing shorts across the 52 positions and requiring expensive rework. The anti-wicking feature is particularly important for high-pin-count SMT connectors assembled in high-volume production runs.
For a mezzanine card design requiring adjustable board-to-board standoff height, how does TSM-126-02-F-DH-A-K-TR's DH option help?
The DH (dual-height) housing option on TSM-126-02-F-DH-A-K-TR provides a taller insulator body compared to the standard single-height TSM series, accommodating board-to-board stack heights where additional clearance of several millimeters is required between the base PCB and the mezzanine module. This suits designs where components taller than 2 mm on the base board must fit beneath the mezzanine card without mechanical interference.
Is TSM-126-02-F-DH-A-K-TR supplied in tape-and-reel for automated assembly, and what production volume does this serve?
Yes, the -TR suffix confirms tape-and-reel packaging, typically with 500 or 1000 pieces per reel for use in automated SMT pick-and-place assembly. This packaging format ensures the 52-position connector is accurately fed to the placement head within ±0.1 mm, enabling high-yield solder joint formation across all 52 pads during standard IPC-compliant reflow profiles.
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