TSM-126-01-SS-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-126-01-SS-DH-A-K-TR is a 52-position, 0.100-inch pitch dual-row surface mount terminal strip with short (SS) stack height, gold-plated contacts, and tape-and-reel packaging for automated SMT assembly. Each contact is rated at 1 A and 125 V AC/DC for reliable multi-channel signal routing. Available through authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 52
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 52 positions (26 per row) on 0.100" (2.54 mm) pitch dual-row configuration for high channel-count SMT interconnects
- Short (SS) stack height variant minimizes above-board profile for slim board-to-board stacking applications
- Gold-plated contacts deliver contact resistance under 20 mΩ and superior corrosion resistance across thousands of mating cycles
- Tape-and-reel (TR) packaging enables direct loading into high-speed pick-and-place machines for automated SMT production
- Rated 1 A per contact and 125 V AC/DC, supporting diverse signal and low-power interconnect requirements
Applications
The TSM-126-01-SS-DH-A-K-TR is ideal for high-density embedded computing boards, FPGA mezzanine modules, and industrial backplane assemblies requiring 52 discrete signal connections in a compact SMT form factor with minimal stack height. Its short profile makes it well-suited for slim rack-mount server blades and portable industrial data loggers where board-to-board clearance is limited. The tape-and-reel format supports efficient high-volume PCB assembly in automated manufacturing environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pin count and pitch of the TSM-126-01-SS-DH-A-K-TR connector?
The TSM-126-01-SS-DH-A-K-TR provides 52 positions arranged in 2 rows of 26 contacts each, on a 0.100-inch (2.54 mm) pitch. Each contact is rated at 1 A and 125 V AC/DC, enabling 52-channel signal routing in a compact surface mount footprint suitable for FPGA mezzanine and backplane applications.
How does the short (SS) stack height benefit board stacking in slim embedded designs?
The short (SS) height designation means the connector body protrudes only a few millimeters above the PCB surface, enabling board-to-board mated heights under 8 mm in stacked module designs. This is critical for slim embedded computing blades, portable industrial data loggers, and aerospace avionics modules with strict total assembly thickness constraints of less than 20 mm.
Which reflow soldering profile is recommended for assembling the TSM-126-01-SS-DH-A-K-TR?
The TSM-126-01-SS-DH-A-K-TR supports standard SMT reflow soldering up to a peak temperature of 260 °C per JEDEC J-STD-020. Its tape-and-reel packaging enables direct compatibility with automated pick-and-place systems, supporting assembly throughput of thousands of units per hour without manual component handling, reducing production costs significantly.
What temperature range does TSM-126-01-SS-DH-A-K-TR support for industrial environments?
The TSM-126-01-SS-DH-A-K-TR operates reliably from -55 °C to +125 °C, making it suitable for harsh industrial environments including outdoor telecommunications cabinets, factory automation controllers, and military-grade embedded systems that experience wide ambient temperature swings and require uninterrupted 52-channel signal connectivity.
When should a designer choose TSM-126-01-SS-DH-A-K-TR over a through-hole dual-row header for a 52-pin interconnect?
Selecting the SMT TSM-126-01-SS-DH-A-K-TR over a through-hole header eliminates the need for 52 drilled holes, reducing PCB fabrication cost and enabling component placement on both board sides. The surface mount approach also improves board rigidity and supports higher-density routing in designs where the PCB real estate budget is under 60 mm per connector row, common in compact FPGA-based systems.
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