TSM-126-01-SS-DH-A-K-TR SAMTEC Connector (Other) In Stock

SAMTEC TSM-126-01-SS-DH-A-K-TR is a 52-position, 0.100-inch pitch dual-row surface mount terminal strip with short (SS) stack height, gold-plated contacts, and tape-and-reel packaging for automated SMT assembly. Each contact is rated at 1 A and 125 V AC/DC for reliable multi-channel signal routing. Available through authorized distributors with worldwide shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TSM-126-01-SS-DH-A-K-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
52
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 52 positions (26 per row) on 0.100" (2.54 mm) pitch dual-row configuration for high channel-count SMT interconnects
  • Short (SS) stack height variant minimizes above-board profile for slim board-to-board stacking applications
  • Gold-plated contacts deliver contact resistance under 20 mΩ and superior corrosion resistance across thousands of mating cycles
  • Tape-and-reel (TR) packaging enables direct loading into high-speed pick-and-place machines for automated SMT production
  • Rated 1 A per contact and 125 V AC/DC, supporting diverse signal and low-power interconnect requirements

Applications

The TSM-126-01-SS-DH-A-K-TR is ideal for high-density embedded computing boards, FPGA mezzanine modules, and industrial backplane assemblies requiring 52 discrete signal connections in a compact SMT form factor with minimal stack height. Its short profile makes it well-suited for slim rack-mount server blades and portable industrial data loggers where board-to-board clearance is limited. The tape-and-reel format supports efficient high-volume PCB assembly in automated manufacturing environments.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Datasheet

TSM-126-01-SS-DH-A-K-TR Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What is the pin count and pitch of the TSM-126-01-SS-DH-A-K-TR connector?

The TSM-126-01-SS-DH-A-K-TR provides 52 positions arranged in 2 rows of 26 contacts each, on a 0.100-inch (2.54 mm) pitch. Each contact is rated at 1 A and 125 V AC/DC, enabling 52-channel signal routing in a compact surface mount footprint suitable for FPGA mezzanine and backplane applications.

How does the short (SS) stack height benefit board stacking in slim embedded designs?

The short (SS) height designation means the connector body protrudes only a few millimeters above the PCB surface, enabling board-to-board mated heights under 8 mm in stacked module designs. This is critical for slim embedded computing blades, portable industrial data loggers, and aerospace avionics modules with strict total assembly thickness constraints of less than 20 mm.

Which reflow soldering profile is recommended for assembling the TSM-126-01-SS-DH-A-K-TR?

The TSM-126-01-SS-DH-A-K-TR supports standard SMT reflow soldering up to a peak temperature of 260 °C per JEDEC J-STD-020. Its tape-and-reel packaging enables direct compatibility with automated pick-and-place systems, supporting assembly throughput of thousands of units per hour without manual component handling, reducing production costs significantly.

What temperature range does TSM-126-01-SS-DH-A-K-TR support for industrial environments?

The TSM-126-01-SS-DH-A-K-TR operates reliably from -55 °C to +125 °C, making it suitable for harsh industrial environments including outdoor telecommunications cabinets, factory automation controllers, and military-grade embedded systems that experience wide ambient temperature swings and require uninterrupted 52-channel signal connectivity.

When should a designer choose TSM-126-01-SS-DH-A-K-TR over a through-hole dual-row header for a 52-pin interconnect?

Selecting the SMT TSM-126-01-SS-DH-A-K-TR over a through-hole header eliminates the need for 52 drilled holes, reducing PCB fabrication cost and enabling component placement on both board sides. The surface mount approach also improves board rigidity and supports higher-density routing in designs where the PCB real estate budget is under 60 mm per connector row, common in compact FPGA-based systems.

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About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Response time is incredible — usually under 4 hours. They understand that production lines can't wait.

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James Wright
Supply Chain Director, CircuitPro Ltd, UK