TSM-125-05-SS-SH-P-TR SAMTEC Connector (Other) In Stock
The TSM-125-05-SS-SH-P-TR is a 25-position, 0.100 inch pitch dual-row surface mount terminal strip from SAMTEC configured in a single-row vertical orientation. It supports 25-signal board interconnects in compact industrial and embedded PCB designs. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 25
- Lifecycle
- ACTIVE
- Datasheet
- TSM-125-05-SS-SH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-125-05-SS-SH-P-TR?
- 25-position dual-row layout at 0.100 inch (2.54 mm) pitch providing a standard PCB grid-aligned SMT terminal strip
- Single-row vertical (SH) orientation allows right-angle or vertical signal routing for space-constrained board edge placements
- Tape and reel (TR) packaging enables high-volume automated pick-and-place SMT assembly
- Compact 2.54 mm pitch reduces board space requirements compared to larger-pitch alternatives for 25-position interconnects
What is TSM-125-05-SS-SH-P-TR used for?
The TSM-125-05-SS-SH-P-TR is suited for 25-position signal interconnect applications in industrial control modules, embedded computing boards, and consumer electronics where a compact 0.100 inch pitch SMT terminal strip with a vertical orientation is needed. Its dual-row 25-position configuration supports interfaces such as 16-bit data buses with control and power lines in a footprint optimized for automated SMT assembly. The tape-and-reel format makes it well-matched for high-volume production environments requiring consistent pick-and-place placement accuracy.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-125-05-SS-SH-P-TR datasheet?
TSM-125-05-SS-SH-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-125-05-SS-SH-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What configuration and pitch does the TSM-125-05-SS-SH-P-TR provide for board interconnects?
The TSM-125-05-SS-SH-P-TR is a 25-position terminal strip at 0.100 inch (2.54 mm) pitch in a dual-row, single-row vertical layout. The 2.54 mm pitch matches standard PCB grid spacing, simplifying land pattern design and trace routing, while 25 positions in a vertical SMT configuration support up to 25 signal or power connections per connector in a compact board footprint.
How does the SH (single-row vertical) orientation of TSM-125-05-SS-SH-P-TR benefit PCB layout?
The SH vertical orientation positions the mating face perpendicular to the PCB surface, allowing the connector to mate with a vertical header or cable assembly plugged in from above the board. This vertical configuration minimizes the connector's horizontal board footprint compared to right-angle alternatives, saving approximately 5 to 8 mm of board depth while still providing 25 positions at 2.54 mm pitch for the mating interface.
For a 16-bit embedded bus interface, how well does the TSM-125-05-SS-SH-P-TR accommodate the required signal count?
A 16-bit data bus with typical control signals (chip select, read/write, clock, interrupt) totals approximately 20 to 24 lines. The TSM-125-05-SS-SH-P-TR's 25-position capacity accommodates a full 16-bit data bus plus up to 9 additional control or power lines in a single connector, eliminating the need for multiple connectors and reducing board assembly cost for embedded bus interface boards operating at standard 2.54 mm pitch.
Is the TSM-125-05-SS-SH-P-TR suitable for high-volume PCB manufacturing and what packaging does it use?
Yes, the TSM-125-05-SS-SH-P-TR comes in tape and reel (TR) format, compatible with automated SMT pick-and-place machines and standard reflow ovens at peak temperatures up to 260 degrees C per J-STD-020. Tape and reel packaging reduces component handling time by enabling continuous feeder-based placement, which is essential for high-volume PCB assembly runs where manual component loading of individual pieces would create a production bottleneck.
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