TSM-125-03-F-DH-A-K-TR SAMTEC Connector (Other) In Stock
Samtec TSM-125-03-F-DH-A-K-TR is a 50-position, 0.100" (2.54 mm) pitch SMT dual-row terminal strip with a dual-height (DH) body profile. It features gold-plated contacts and surface-mount termination for high-density PCB header connections in compact embedded systems.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 50
- Lifecycle
- ACTIVE
- Datasheet
- TSM-125-03-F-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-125-03-F-DH-A-K-TR?
- 50-position dual-row layout at 0.100" (2.54 mm) pitch enables high-density SMT terminal strip connections for wide parallel bus interfaces
- Dual-height (DH) body design provides clearance options for PCB stackup and shrouded connector mating in space-constrained assemblies
- Gold-plated (F) contact finish delivers low and stable contact resistance across hundreds of mating cycles for signal integrity
- Tape-and-reel (TR) packaging enables automated pick-and-place assembly for high-volume SMT PCB production
What is TSM-125-03-F-DH-A-K-TR used for?
The TSM-125-03-F-DH-A-K-TR is designed for high-density, 50-position board-to-board and board-to-cable SMT interconnects in embedded computing, industrial automation controllers, and data acquisition systems where a 0.100" pitch dual-row terminal strip is required. Its dual-height body accommodates mated connector housings with clearance for shrouded or keyed receptacles on adjacent boards. The connector is also used in FPGA development platforms, test and measurement equipment, and prototyping modules requiring reliable surface-mount header strips with gold-plated contacts.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-125-03-F-DH-A-K-TR datasheet?
TSM-125-03-F-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-125-03-F-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the DH designation in TSM-125-03-F-DH-A-K-TR indicate about the connector body?
The DH designation stands for dual-height, meaning the connector body has an extended profile that provides additional clearance between the PCB surface and the mating connector. This dual-height design accommodates taller or shrouded receptacle housings and allows the mated pair to clear adjacent components in dense PCB assemblies with 50 contacts at 0.100" (2.54 mm) pitch.
How does the gold-plated contact finish on the TSM-125-03-F-DH-A-K-TR benefit high-cycle-life connector applications?
The gold-plated (F) contact finish on the TSM-125-03-F-DH-A-K-TR provides a hard, corrosion-resistant mating surface that maintains low contact resistance (typically below 20 mΩ) across hundreds of mating and unmating cycles. Gold does not oxidize at normal operating temperatures, ensuring consistent signal quality in test socket, hot-swap module, and frequently serviced equipment applications over the product lifetime.
Which parallel bus or interface applications benefit most from a 50-position SMT terminal strip at 0.100" pitch?
A 50-position, 0.100" pitch SMT terminal strip like the TSM-125-03-F-DH-A-K-TR suits 16-bit to 32-bit parallel data buses with address and control lines, 50-pin ribbon cable headers for data acquisition, and GPIO expansion interfaces on industrial single-board computers. The 25 contacts per row at 2.54 mm spacing provides enough channel density for full memory bus or sensor array interfaces while remaining compatible with standard IDC cable assemblies.
Why does the tape-and-reel (TR) packaging of the TSM-125-03-F-DH-A-K-TR matter for manufacturing?
The tape-and-reel (TR) packaging of the TSM-125-03-F-DH-A-K-TR allows the connector to be fed directly into standard automated SMT pick-and-place machines during PCB assembly. For a 50-position SMT part, automated placement eliminates the manual orientation errors common in tray or bulk packaging, reduces placement cycle time per board, and supports continuous high-volume production runs without operator intervention for connector loading.
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