TSM-125-02-T-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-125-02-T-DH-A-K-TR is a 50-position dual-row surface-mount terminal strip with 0.100 inch (2.54 mm) pitch, designed for high-density SMT signal connections on PCBs. Available in stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 50
- Lifecycle
- ACTIVE
- Datasheet
- TSM-125-02-T-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 50-position dual-row layout at 0.100 inch (2.54 mm) pitch supporting high pin-count SMT designs
- Surface-mount termination compatible with standard reflow and automated pick-and-place assembly
- Tape-and-reel packaging (TR suffix) enabling high-volume automated PCB manufacturing
- Dual-header profile reduces required board edge length versus equivalent single-row strips
Applications
The TSM-125-02-T-DH-A-K-TR is ideal for high-density signal interface strips on embedded computing boards, industrial I/O modules, and test equipment motherboards where 50 positions are needed within a compact SMT footprint. Its 0.100 inch pitch maintains compatibility with legacy 2.54 mm grid PCB layouts while enabling modern surface-mount assembly. Tape-and-reel packaging supports high-volume production lines in consumer electronics and telecom equipment manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the TSM-125-02-T-DH-A-K-TR provide?
The TSM-125-02-T-DH-A-K-TR is a 50-position, dual-row surface-mount terminal strip at 0.100 inch (2.54 mm) pitch, providing 25 positions per row for high-density signal routing on SMT PCBs.
Does TSM-125-02-T-DH-A-K-TR support automated reel-based PCB assembly?
Yes, the TR suffix indicates tape-and-reel packaging, making the TSM-125-02-T-DH-A-K-TR fully compatible with automated pick-and-place equipment and standard reflow soldering processes used in high-volume production environments.
For which embedded system designs is TSM-125-02-T-DH-A-K-TR most appropriate?
Industrial I/O expansion cards, embedded processor breakout boards, and test fixture motherboards that require 50 signals at a standard 2.54 mm grid are best suited for TSM-125-02-T-DH-A-K-TR's dual-row SMT configuration.
When would an engineer choose TSM-125-02-T-DH-A-K-TR over a through-hole equivalent at the same pitch?
TSM-125-02-T-DH-A-K-TR is preferred when the PCB has no plated through-holes at the connector site, or when the design is fully SMT to reduce manufacturing steps; it supports reflow at standard SMT temperature profiles without requiring wave soldering or hand assembly of 50 pins.
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