TSM-125-02-L-DV SAMTEC Connector (Other) In Stock
SAMTEC TSM-125-02-L-DV is a 250-pin dual-row through-hole receptacle connector with 0.100 inch pitch, gold-over-nickel mating contacts, and tin-over-nickel termination. Rated for board-to-board applications with a 2.5 inch body length. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 50
- Lifecycle
- ACTIVE
- Datasheet
- TSM-125-02-L-DV Datasheet PDF
- Category
- Connector
- Temp Range
- -65.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 250-pin dual-row receptacle with 0.100 inch pitch for high-density board-to-board connections
- Gold (10 µin) over Nickel (50 µin) mating contacts for reliable low-resistance signal integrity
- Tin over Nickel barrier termination finish compatible with standard PCB soldering processes
- RoHS compliant construction with 1-week factory lead time for fast procurement
Applications
The TSM-125-02-L-DV is well-suited for board-to-board stacking and mezzanine interconnect applications in industrial control systems, data acquisition modules, and embedded computing platforms. Its 250-pin dual-row configuration supports high-density signal routing in backplane and daughter-card designs. The gold-plated mating contacts ensure long-term reliability in environments with frequent mating cycles.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 9.1 |
| Body Breadth | 0.2inch |
| Body Depth | 0.1inch |
| Body Length | 2.5inch |
| Body/Shell Style | RECEPTACLE |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 1000VAC V |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Contact Row Spacing | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 5.4864mm |
| Plating Thickness | 10u inch |
| Rated Current (Signal) | 3A |
| Reference Standard | UL |
| Terminal Pitch | 2.54mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 50 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, Malaysia |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and pin count of the TSM-125-02-L-DV connector?
The TSM-125-02-L-DV features a 0.100 inch (2.54 mm) pitch dual-row receptacle with a total of 250 pins arranged across a 2.5 inch body length. This high pin count supports dense signal and power routing in board-to-board interconnect designs.
Which PCB stacking and mezzanine designs benefit most from the TSM-125-02-L-DV?
Designs requiring high-density through-hole board-to-board connections, such as industrial backplanes, embedded computing daughter cards, and data acquisition modules, benefit most from this connector. Its 250-pin dual-row layout at 0.100 inch pitch enables compact signal routing across mating boards.
What contact finish does the TSM-125-02-L-DV use, and why does it matter for reliability?
The mating contacts are plated with Gold (10 µin) over Nickel (50 µin), providing low contact resistance and excellent corrosion resistance over thousands of mating cycles. The termination side uses Tin (Sn) over a Nickel (Ni) barrier, ensuring strong solder joint adhesion to standard PCB pads.
Is the TSM-125-02-L-DV RoHS compliant and what is the typical lead time?
Yes, the TSM-125-02-L-DV is fully RoHS compliant with a Pb-free designation. SAMTEC lists a 1-week factory lead time for this part, making it accessible for prototyping and production builds without extended procurement delays.
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