TSM-125-01-TL-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-125-01-TL-DH-A-K-TR is a 50-position, 2.54 mm (0.100") pitch surface mount terminal strip with dual-row through-hole tails. Designed for reliable signal interconnect in compact PCB assemblies. Available with tape-and-reel packaging for automated assembly processes.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 50
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 50-position dual-row surface mount terminal strip with 2.54 mm (0.100") pitch for high-density board interconnect
- Through-hole tails with surface mount body enable strong mechanical retention and reliable solder joint integrity
- Tape-and-reel (TR) packaging supports automated pick-and-place assembly on high-volume production lines
- SAMTEC quality construction ensures consistent contact resistance and long mating cycle life across industrial temperature ranges
Applications
The TSM-125-01-TL-DH-A-K-TR is well-suited for backplane and daughtercard interconnect in industrial control systems and embedded computing platforms. Its 50-position, 2.54 mm pitch layout accommodates dense signal routing in test and measurement equipment. The tape-and-reel format makes it ideal for high-volume automated PCB assembly in communications and data acquisition hardware.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-125-01-TL-DH-A-K-TR have and what is its pitch?
The TSM-125-01-TL-DH-A-K-TR features 50 positions arranged in a dual-row configuration with a 2.54 mm (0.100") pitch, making it compatible with standard 0.100" grid PCB layouts commonly used in industrial and embedded systems.
What assembly method does the TSM-125-01-TL-DH-A-K-TR support and how is it packaged for production?
This connector uses a surface mount body combined with through-hole tails, supporting both SMT reflow and wave solder processes. It ships in tape-and-reel (TR) packaging to enable automated pick-and-place assembly at high-volume production rates, typically processing thousands of parts per reel.
In which types of systems is TSM-125-01-TL-DH-A-K-TR typically used?
TSM-125-01-TL-DH-A-K-TR is used in backplane interconnect designs, daughtercard interfaces, test and measurement boards, and industrial control modules where 50 signal contacts at 2.54 mm pitch are required. It also appears in data acquisition and communications hardware.
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