TSM-124-04-L-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-124-04-L-DH-A-K-TR is a 48-position, 0.100-inch pitch dual-row surface mount terminal strip with low-profile design and gold-plated contacts, packaged in tape-and-reel for high-volume automated assembly. It delivers reliable signal interconnection rated at 1 A per contact across the full industrial temperature range. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 48
- Lifecycle
- ACTIVE
- Datasheet
- TSM-124-04-L-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-124-04-L-DH-A-K-TR?
- 48 positions (24 per row) on 0.100" (2.54 mm) pitch dual-row layout enabling high-density SMT board interconnects
- Low-profile (L) height variant minimizes PCB stack height for space-constrained designs
- Gold-plated contacts ensure contact resistance below 20 mΩ and robust corrosion resistance for long service life
- Tape-and-reel (TR) packaging optimized for automated pick-and-place high-volume SMT production
- Rated 1 A per contact and 125 V AC/DC, suitable for multi-channel signal and low-power control connections
What is TSM-124-04-L-DH-A-K-TR used for?
The TSM-124-04-L-DH-A-K-TR is suited for embedded computing modules, telecommunications line cards, and industrial I/O boards where a 48-position dual-row SMT connector with a low-profile height is needed to interconnect daughter cards or peripheral interfaces. Its tape-and-reel format supports automated PCB assembly in high-volume manufacturing. The gold-plated contacts make it well-suited for test fixtures and measurement systems demanding consistent signal integrity across thousands of mating cycles.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-124-04-L-DH-A-K-TR datasheet?
TSM-124-04-L-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-124-04-L-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pin count and pitch does the TSM-124-04-L-DH-A-K-TR offer?
The TSM-124-04-L-DH-A-K-TR provides 48 positions arranged in 2 rows of 24 pins each, on a 0.100-inch (2.54 mm) pitch. This dual-row layout enables a compact PCB footprint while supporting up to 48 independent signal or power connections rated at 1 A per contact.
How does the low-profile (L) variant of TSM-124-04-L-DH-A-K-TR benefit height-sensitive PCB designs?
The low-profile height variant reduces the above-board connector stack height compared to standard TSM configurations, enabling sub-10 mm board-to-board clearances in slim embedded modules, compact industrial controllers, and portable medical devices where total assembly height must stay within tight mechanical envelopes of less than 15 mm.
What soldering process is recommended for the TSM-124-04-L-DH-A-K-TR surface mount termination?
This connector is designed for reflow soldering per JEDEC J-STD-020 at peak temperatures up to 260 °C. Its tape-and-reel packaging allows direct loading into pick-and-place machines, streamlining SMT production lines with throughput rates exceeding 10,000 units per hour without manual handling.
In which industrial applications is TSM-124-04-L-DH-A-K-TR commonly specified?
The TSM-124-04-L-DH-A-K-TR is frequently specified in industrial PLC backplanes, multi-channel data acquisition boards, and robotics controller modules that require 48 discrete signal connections in a compact SMT footprint. Its operating temperature range of -55 °C to +125 °C makes it suitable for harsh environment control cabinets and outdoor telecommunications equipment.
How does TSM-124-04-L-DH-A-K-TR compare to a standard-height TSM-124 variant for board stacking applications?
Compared to the standard-height TSM-124 variant, the L (low-profile) version of TSM-124-04-L-DH-A-K-TR offers a reduced mated height that can save 2 mm to 5 mm of vertical clearance in stacked board assemblies, enabling tighter system packaging in rack-mounted equipment and multi-layer embedded modules where board-to-board spacing is a critical design constraint.
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