TSM-124-03-TM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-124-03-TM-DH-A-K-TR is a 48-position dual-row surface mount terminal strip on 0.100 inch pitch, supplied in tape-and-reel packaging for high-volume automated PCB assembly. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 48
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 48 positions in a dual-row layout on standard 0.100 inch (2.54 mm) pitch for broad compatibility with ribbon cables and standard headers
- Surface mount termination for automated reflow soldering in SMT production lines
- Tape-and-reel (TR) packaging supports high-speed pick-and-place assembly with minimal manual handling
- Dual-row configuration provides high pin density for interfacing data buses, FPGAs, and multi-signal designs
- SAMTEC precision tooling ensures tight contact tolerances and consistent mating performance across all 48 positions
Applications
The TSM-124-03-TM-DH-A-K-TR is designed for development platforms, FPGA expansion headers, and industrial backplane interconnects requiring 48 signals over a standard 0.100 inch dual-row footprint. Its SMT format enables placement alongside other surface mount components in a unified reflow process, reducing assembly steps. The tape-and-reel supply format makes it practical for medium-to-high volume production runs in consumer electronics and embedded computing products.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-124-03-TM-DH-A-K-TR provide, and what row configuration is used?
The TSM-124-03-TM-DH-A-K-TR provides 48 positions arranged in a dual-row configuration on a 0.100 inch (2.54 mm) pitch. This standard pitch is directly compatible with common 48-pin ribbon cable connectors, IDC headers, and prototyping boards that follow the 2.54 mm grid.
What soldering process is recommended for the TSM-124-03-TM-DH-A-K-TR, and does its packaging support automated assembly?
The TSM-124-03-TM-DH-A-K-TR uses surface mount termination suitable for reflow soldering at standard SMT profiles with peak temperatures up to approximately 260°C. It is supplied in tape-and-reel (TR) packaging, enabling automated pick-and-place assembly and eliminating manual component placement on high-volume production lines.
When would a designer choose the 48-position TSM-124-03-TM-DH-A-K-TR over a smaller connector like a 26-position version?
A designer selects the 48-position variant when the interface must carry wide parallel data buses, such as 32-bit data plus control signals, or when aggregating multiple I2C, SPI, UART, and GPIO lines from a microcontroller or FPGA into a single 0.100 inch dual-row connector rather than using multiple smaller connectors. The 48-pin count also matches common JEDEC memory module and PC/104 expansion pinouts directly.
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