TSM-123-05-T-SH-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-123-05-T-SH-P-TR is a 23-position, 0.100" (2.54 mm) pitch surface mount terminal strip in a dual-row, single-row vertical configuration, rated for 3 A per contact and 250 V. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 23
- Lifecycle
- ACTIVE
- Datasheet
- TSM-123-05-T-SH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 23 positions at 0.100" (2.54 mm) pitch in a dual-row surface mount layout for versatile PCB connectivity
- Rated 3 A per contact and 250 V for dependable signal and low-power distribution
- Single-row vertical termination allows space-efficient right-angle mounting on PCB edges
- Tape-and-reel packaging (TR suffix) enables high-volume automated SMT assembly
Applications
The TSM-123-05-T-SH-P-TR is used in industrial controls, embedded computing, and communication boards requiring 23-position surface mount terminal connections at 0.100" pitch. Its dual-row vertical configuration is ideal for backplane and mezzanine card applications where height clearance and high pin density are both considerations. Tape-and-reel packaging supports high-volume automated pick-and-place assembly in manufacturing environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What current and voltage ratings does the TSM-123-05-T-SH-P-TR support per contact?
Each contact in the TSM-123-05-T-SH-P-TR is rated for 3 A and 250 V, making it suitable for signal distribution and low-power supply connections across all 23 positions in its 0.100" (2.54 mm) pitch dual-row surface mount footprint.
Why choose the TSM-123-05-T-SH-P-TR over a through-hole terminal strip for automated production?
The TSM-123-05-T-SH-P-TR comes in tape-and-reel (TR) packaging and uses surface mount termination, enabling automated pick-and-place and reflow soldering without hand insertion. This reduces assembly cycle time and cost for 23-position, 0.100" pitch connections in high-volume industrial and communications PCB production.
Which board-level applications benefit from the dual-row 0.100" pitch layout of the TSM-123-05-T-SH-P-TR?
The dual-row, 0.100" (2.54 mm) pitch layout of the TSM-123-05-T-SH-P-TR suits backplane interconnects, embedded system daughter cards, and test fixture interfaces where 23-position connections must fit a compact board area. Industrial PLC modules and embedded computing carrier boards commonly use this configuration for signal and power routing between PCB layers.
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