TSM-123-03-F-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-123-03-F-DH-A-K-TR is a 46-position dual-row surface-mount terminal strip with 0.100" (2.54 mm) pitch, providing reliable high-pin-count board-to-board connectivity in standard SMT form. Tape-and-reel packaging supports automated assembly in high-volume production. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 46
- Lifecycle
- ACTIVE
- Datasheet
- TSM-123-03-F-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-123-03-F-DH-A-K-TR?
- 46-position dual-row SMT terminal strip with 0.100" (2.54 mm) pitch for standard high-pin-count board-to-board interconnects
- DH (dual-row high-profile) configuration enabling mezzanine stacking with clearance for components placed between boards
- Tape-and-reel (TR) packaging for seamless integration into automated pick-and-place SMT production lines
What is TSM-123-03-F-DH-A-K-TR used for?
The TSM-123-03-F-DH-A-K-TR is suited for high-pin-count board-to-board interconnects in embedded computing systems, FPGA evaluation boards, industrial controllers, and expansion slot interfaces requiring 46 positions at standard 2.54 mm pitch. The dual-row high-profile body allows stacked board configurations with adequate clearance for through-hole or tall SMD components between boards. Tape-and-reel packaging facilitates high-throughput automated PCB assembly.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-123-03-F-DH-A-K-TR datasheet?
TSM-123-03-F-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-123-03-F-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact count and pitch of the TSM-123-03-F-DH-A-K-TR terminal strip?
The TSM-123-03-F-DH-A-K-TR provides 46 total positions in a dual-row layout (23 per row) with a 0.100" (2.54 mm) pitch. This standard-pitch, high-count configuration supports broad signal and power distribution across FPGA daughter cards, industrial backplanes, and 46-pin expansion connector interfaces.
How does the DH (dual-row high-profile) body of TSM-123-03-F-DH-A-K-TR benefit stacked module designs?
The high-profile (DH) body provides increased standoff height between mated boards compared to low-profile variants, typically 8 mm to 11 mm clearance, allowing components such as capacitors, resistors, and ICs to be populated on both sides of the stacked boards without mechanical interference. This is critical in computing module stacks and RF front-end sub-assemblies.
Can the TSM-123-03-F-DH-A-K-TR handle both signal and power pins simultaneously?
Yes. At the 0.100" (2.54 mm) pitch, individual contacts in the TSM series typically support up to 2 A per pin for signal and light-power routing. With 46 positions available, designers can dedicate certain rows to ground and power rails (e.g., 3.3 V or 5 V) while using remaining pins for digital data signals in embedded and industrial control systems.
Which socket series from SAMTEC mates with the TSM-123-03-F-DH-A-K-TR?
The TSM-123-03-F-DH-A-K-TR is designed to mate with SAMTEC's SSM or SSW series 0.100" (2.54 mm) dual-row socket strips in the 23-position-per-row configuration. These mated connector pairs are rated for operating temperatures from -55°C to +125°C and support per-contact current ratings up to 2 A, appropriate for industrial, computing, and communication applications.
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