TSM-121-03-LM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-121-03-LM-DH-A-K-TR is a 42-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch and low-mount (LM) dual-height (DH) housing. Features high pin count for wide bus interfaces, RoHS-compliant construction, and tape-and-reel packaging for automated assembly. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 42
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 42-position dual-row layout at 0.100" (2.54 mm) pitch supports wide parallel bus and multi-rail mixed signal connections
- Low-mount (LM) dual-height (DH) housing reduces overall assembly height in board stacking configurations
- Tape-and-reel (TR) packaging enables high-volume automated pick-and-place SMT assembly
- High position count in a single connector body simplifies BOM and reduces PCB connector placement operations
Applications
The TSM-121-03-LM-DH-A-K-TR is designed for wide parallel bus interfaces, GPIO expansion headers, and mixed signal and power connections in embedded computing boards, industrial PLCs, and development platforms. Its 42-position dual-row layout at 2.54 mm pitch consolidates multiple interface channels into a single low-mount connector, reducing connector count and simplifying mating operations in high channel count systems.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the 42-position dual-row layout of TSM-121-03-LM-DH-A-K-TR enable in terms of bus or signal routing?
The TSM-121-03-LM-DH-A-K-TR provides 42 total positions arranged in 2 rows of 21 at 0.100" (2.54 mm) pitch, enabling up to 42 independent signal or power lines in a single connector. This is sufficient for routing a 32-bit parallel data bus plus control signals, or for accommodating a large mixed GPIO and power header in embedded computing boards or industrial PLC backplanes.
How does the low-mount (LM) designation of TSM-121-03-LM-DH-A-K-TR benefit board stacking designs?
The low-mount (LM) designation indicates that the TSM-121-03-LM-DH-A-K-TR has a reduced body height above the PCB surface compared to standard-height variants. This allows the 42-position, 2.54 mm pitch connector to mate with boards in tight stacking configurations where overall stack height is constrained, providing reliable electrical connection while minimizing the gap between stacked PCBs.
Is TSM-121-03-LM-DH-A-K-TR in tape-and-reel packaging and how does this affect volume production assembly?
Yes, the TR suffix on TSM-121-03-LM-DH-A-K-TR confirms tape-and-reel packaging, which is compatible with automated pick-and-place SMT assembly machines. Tape-and-reel delivery eliminates manual component handling for the 42-position connector and reduces placement cycle time in high-volume production runs, lowering assembly cost per board compared to cut-tape or tray-packaged alternatives at the same 2.54 mm pitch.
When would TSM-121-03-LM-DH-A-K-TR be selected over a 2x21 through-hole header in a new PCB design?
The TSM-121-03-LM-DH-A-K-TR is preferred over a through-hole 2x21 header when the PCB design targets fully automated SMT assembly without drilling, and when the low-mount height is needed to reduce the board stack profile below what through-hole alternatives allow. Its tape-and-reel packaging further justifies selection in production volumes above a few hundred units, where the automated placement efficiency of the 42-position SMT connector offsets any premium over through-hole parts priced at 2.54 mm pitch.
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