TSM-120-03-SM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-120-03-SM-DH-A-K-TR is a 40-position dual-row 2.54mm pitch surface mount terminal strip with solder mask defined (SM) pads and gold-plated contacts. Tape-and-reel packaging supports automated SMT assembly for medium to high production volumes. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 40
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-120-03-SM-DH-A-K-TR?
- 40-position dual-row layout with 2.54mm (100mil) pitch provides balanced pin density for mid-range SMT board connector applications
- Solder mask defined (SM) pad variant improves solder joint reliability and reduces bridging risk on high pin-count 40-position SMT footprints
- Tape-and-reel (TR) packaging enables automated SMT pick-and-place assembly, reducing per-unit placement cost in volume production
What is TSM-120-03-SM-DH-A-K-TR used for?
TSM-120-03-SM-DH-A-K-TR is suited for mid-range pin-count PCB interconnect needs in industrial controllers, embedded computing modules, and test equipment motherboards. The 40-position dual-row 2.54mm pitch configuration is a common choice for module expansion slots, debug headers with 32 or more signal pins, and multi-channel data acquisition boards where reliable SMT solder joints are critical.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-120-03-SM-DH-A-K-TR datasheet?
TSM-120-03-SM-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-120-03-SM-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the 'SM' designation mean in TSM-120-03-SM-DH-A-K-TR and how does it improve soldering quality?
The 'SM' designation in TSM-120-03-SM-DH-A-K-TR indicates solder mask defined pads, where the solder mask opening defines the solderable pad area rather than the copper. This method reduces solder bridging risk between adjacent pads on the 40-position dual-row 2.54mm pitch footprint, improving solder joint consistency and yield in automated SMT reflow assembly.
How does TSM-120-03-SM-DH-A-K-TR support reliable connections for mid-range pin-count PCB interfaces?
TSM-120-03-SM-DH-A-K-TR provides 40 positions in a dual-row 2.54mm (100mil) pitch layout, sufficient for interfaces combining 32 data signals plus power and ground rails. Gold-plated mating contacts ensure low contact resistance below 20 milliohms, supporting stable signal integrity for parallel bus, sensor array, or module expansion connections over the connector's service life.
Is TSM-120-03-SM-DH-A-K-TR suitable for use in industrial-grade PCB assemblies?
Yes, TSM-120-03-SM-DH-A-K-TR is well-suited for industrial applications requiring robust 40-pin SMT connectivity. The gold-plated contacts maintain reliable electrical performance across temperature ranges from -40°C to +85°C typical for industrial-grade components, and the tape-and-reel packaging supports volume production on automated SMT lines used in PLC, HMI, and industrial communication board manufacturing.
What is the advantage of ordering TSM-120-03-SM-DH-A-K-TR in tape-and-reel format for production?
Tape-and-reel (TR) format for TSM-120-03-SM-DH-A-K-TR eliminates manual loading into feeders and ensures consistent connector orientation for automated pick-and-place machines. For production runs of 500 or more boards, this reduces placement cycle time per board by several seconds compared to cut-tape or tray packaging, directly lowering assembly cost per unit.
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