TSM-120-02-F-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-120-02-F-DH-A-K-TR is a 40-position dual-row surface-mount terminal strip on a 2.54 mm (0.100") pitch, offering high-density board-level signal and power interconnect in a tape-and-reel SMT package. Designed for automated pick-and-place assembly with reliable contact performance; available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 40
- Lifecycle
- ACTIVE
- Datasheet
- TSM-120-02-F-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 40 positions across dual rows on 2.54 mm (0.100 inch) pitch delivers maximum signal density in a compact SMT footprint
- Tape-and-reel (TR) packaging enables high-volume automated pick-and-place assembly without manual handling
- Dual-row architecture provides 40 circuits in roughly half the board length of an equivalent single-row strip
- SAMTEC precision contacts ensure consistent mating force and low contact resistance across repeated insertion cycles
- Surface-mount construction eliminates through-hole drilling and supports high-speed SMT production lines
Applications
The TSM-120-02-F-DH-A-K-TR is used in backplane and mezzanine board interconnects within telecommunications and server equipment where 40 signal or power lines must bridge two PCBs at standard 0.100 inch pitch. Its dual-row SMT layout suits data acquisition cards and DSP processing boards where connector density and automated placement throughput are both critical. Test fixture and development board designs also employ this strip to provide high pin-count signal access in a standard 2.54 mm grid footprint compatible with ribbon cables and transition headers.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-120-02-F-DH-A-K-TR provide, and in what row configuration?
The TSM-120-02-F-DH-A-K-TR provides 40 positions arranged in a dual-row configuration on 2.54 mm (0.100 inch) pitch, giving 20 contacts per row. This dual-row layout accommodates 40 independent signal or power lines in a board length of approximately 50.8 mm, compared to 101.6 mm that a single-row 40-position strip would require, making it a practical choice for dense backplane and daughter-card connectors.
What does the tape-and-reel (TR) suffix mean for production planning of the TSM-120-02-F-DH-A-K-TR?
The TR suffix indicates the TSM-120-02-F-DH-A-K-TR is supplied in tape-and-reel format, with components packaged on continuous carrier tape wound on reels of typically 250 to 2000 pieces. This packaging is mandatory for automated pick-and-place machines in surface-mount production lines, avoiding the manual feed required for tube- or tray-packed parts and enabling uninterrupted high-volume PCB assembly at throughput rates of thousands of placements per hour.
For a 48-channel industrial I/O card, can the TSM-120-02-F-DH-A-K-TR serve as the board-edge connector?
The TSM-120-02-F-DH-A-K-TR's 40 positions can carry up to 40 signal lines, handling the core I/O channels of a 32- or 40-channel industrial card directly, with the remaining 8 channels routed to a supplementary connector if needed. At 2.54 mm pitch and with SAMTEC's typical 3 A per pin current rating for signal-grade contacts, the strip also supports mixed signal-and-power configurations where several pins carry 5 V or 3.3 V supply rails alongside I/O signals.
How does the dual-row TSM-120-02-F-DH-A-K-TR compare to a 40-pin single-row strip for PCB space saving?
A 40-pin single-row SMT terminal strip at 2.54 mm pitch spans approximately 100 mm in length. The dual-row TSM-120-02-F-DH-A-K-TR carries the same 40 circuits in a 20-position-per-row layout occupying roughly 50 mm x 5 mm, halving the connector length along one PCB edge. This allows designers to free 50 mm of board-edge real estate for additional circuitry or to shrink the PCB dimensions directly, which is particularly valuable in compact embedded computing or communications modules.
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