TSM-119-04-F-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-119-04-F-DH-A-K-TR is a 38-position surface mount terminal strip with 0.100" pitch in a dual-height configuration. Designed for reliable SMT board-level connections in space-efficient layouts. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 38
- Lifecycle
- ACTIVE
- Datasheet
- TSM-119-04-F-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 38-position 0.100 inch pitch surface mount terminal strip for high-density board connections
- Dual-height (DH) design accommodates varied PCB stack-up requirements
- Tape-and-reel (TR) packaging supports high-volume automated SMT assembly
Applications
The TSM-119-04-F-DH-A-K-TR is suited for board-to-board and wire-to-board interface applications in industrial and embedded electronics systems. The 38-position 0.100" pitch layout delivers reliable connectivity in backplane assemblies and modular instrumentation designs. Its tape-and-reel format enables efficient pick-and-place assembly in high-volume production environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and position count of the TSM-119-04-F-DH-A-K-TR terminal strip?
The TSM-119-04-F-DH-A-K-TR features a 0.100 inch (2.54 mm) pitch and provides 38 positions in a dual-height surface mount configuration, making it a compact yet high-density terminal strip for board-level signal routing.
Which assembly processes are compatible with the TSM-119-04-F-DH-A-K-TR?
The TSM-119-04-F-DH-A-K-TR comes in tape-and-reel packaging, which is fully compatible with automated pick-and-place SMT assembly. The surface mount termination style supports standard reflow soldering at up to 260°C peak temperature per IPC/JEDEC J-STD-020.
When is the TSM-119-04-F-DH-A-K-TR preferred over through-hole terminal strips?
The TSM-119-04-F-DH-A-K-TR is preferred when a design requires SMT assembly for both sides of a PCB, reducing board thickness requirements. Its 38-position dual-height format provides the same interconnect density as through-hole alternatives while enabling single-pass reflow assembly on boards with limited vertical clearance.
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