TSM-119-03-LM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-119-03-LM-DH-A-K-TR is a 38-position, dual-row surface-mount terminal strip with 0.100 inch (2.54 mm) pitch, supplied in tape and reel for automated assembly. Provides reliable SMT signal header connections in a standard 0.100 inch pitch grid. Available from stock worldwide with global shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 38
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-119-03-LM-DH-A-K-TR?
- 38-position dual-row surface-mount terminal strip at 0.100 inch (2.54 mm) pitch for standard signal interconnects
- Tape and reel (TR) packaging enabling automated SMT pick-and-place assembly for high-volume PCB production
- LM (low-profile male) configuration with DH (dual-height) contacts suited for mating with standard 0.100 inch receptacles
- Dual-row layout providing 19 pins per row for compact 38-position interconnects within minimal PCB footprint
- SAMTEC TSM series reliability with consistent contact force and retention across thousands of mating cycles
What is TSM-119-03-LM-DH-A-K-TR used for?
The TSM-119-03-LM-DH-A-K-TR is a 38-position SMT terminal strip used in PCB-to-PCB and PCB-to-cable signal interconnect applications in prototyping boards, industrial I/O modules, and embedded computing daughter cards where a standard 0.100 inch pitch grid is required. Its dual-row 19-per-row configuration delivers 38 signal connections while occupying minimal board space, making it suitable for GPIO expansion headers, sensor interface boards, and mezzanine stacking connectors. The tape and reel packaging supports automated placement in medium- to high-volume production environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-119-03-LM-DH-A-K-TR datasheet?
TSM-119-03-LM-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-119-03-LM-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does TSM-119-03-LM-DH-A-K-TR have, and what pitch does it use?
The TSM-119-03-LM-DH-A-K-TR has 38 positions arranged in a dual-row layout with 19 pins per row at a 0.100 inch (2.54 mm) pitch. This standard 2.54 mm pitch grid is compatible with the vast majority of 0.100 inch pitch receptacles and ribbon cable connectors, simplifying integration into existing board designs with standard GPIO or signal headers.
What is the advantage of the tape and reel packaging for TSM-119-03-LM-DH-A-K-TR in production environments?
Tape and reel (TR) packaging feeds the TSM-119-03-LM-DH-A-K-TR directly into automated pick-and-place machines, enabling accurate placement at 0.100 inch pitch SMT pads at high throughput. This eliminates manual handling, reduces placement errors, and lowers per-unit assembly cost for production runs requiring hundreds to thousands of 38-position surface-mount terminal strips on industrial I/O boards or embedded computing headers.
Can TSM-119-03-LM-DH-A-K-TR mate with standard 0.100 inch pitch receptacles or IDC ribbon cable connectors?
Yes, the TSM-119-03-LM-DH-A-K-TR is designed with the industry-standard 0.100 inch (2.54 mm) pitch, ensuring compatibility with standard dual-row 38-position receptacles, IDC ribbon cable connectors, and 0.100 inch female headers commonly used in prototyping and production embedded systems. The dual-height (DH) contact style provides adequate mating engagement depth for reliable electrical connection across the 38 positions.
Which design scenarios favor TSM-119-03-LM-DH-A-K-TR over through-hole terminal strips at 2.54 mm pitch?
Designs requiring automated SMT assembly favor the TSM-119-03-LM-DH-A-K-TR over through-hole equivalents because the SMT footprint eliminates drilling costs and allows placement on either side of the PCB. At 38 positions and 0.100 inch pitch, this connector suits GPIO expansion headers, sensor interface boards, and modular backplane signal buses where reflow solder processes must be used to maintain consistency across production runs without manual through-hole soldering.
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