TSM-119-03-H-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-119-03-H-DH-A-K-TR is a 38-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch for standard PCB grid layouts. Features high-profile through-hole compatible design for increased contact retention on SMT boards. Suitable for high-density interconnect applications requiring reliable dual-row signal routing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 38
- Lifecycle
- ACTIVE
- Datasheet
- TSM-119-03-H-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 38-position dual-row layout at 0.100 inch (2.54 mm) pitch compatible with standard 0.1-inch PCB grid for easy layout integration
- High-profile design with dual-height (DH) variant provides clearance for board-stacking configurations up to several mm standoff
- Surface mount termination with tape-and-reel (TR) packaging enables automated pick-and-place assembly for high-volume PCB production
Applications
The TSM-119-03-H-DH-A-K-TR dual-row terminal strip is well-suited for backplane interconnect, SBC expansion headers, and industrial I/O boards that require 38 positions on a 0.100 inch pitch grid. Its surface mount construction supports automated reflow assembly in computing modules, embedded controllers, and test fixture PCBs where consistent pin alignment across 19 pins per row is critical. The dual-height body option provides additional clearance for stacking daughter cards or mating with high-profile receptacles in compact multi-board systems.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pin count and pitch of the TSM-119-03-H-DH-A-K-TR terminal strip?
The TSM-119-03-H-DH-A-K-TR is a 38-position (19 pins per row) dual-row terminal strip with a 0.100 inch (2.54 mm) pitch, making it compatible with standard 0.1-inch PCB grids used in embedded computing and industrial control applications.
How does the dual-height (DH) body option benefit board-stacking designs using the TSM-119-03-H-DH-A-K-TR?
The dual-height body provides additional vertical clearance of several millimeters between PCB layers, allowing daughter card stacking without component interference, which is critical in compact multi-board enclosures operating at standard logic voltages of 3.3 V or 5 V.
What packaging format does the TSM-119-03-H-DH-A-K-TR use and how does it support automated assembly?
The TSM-119-03-H-DH-A-K-TR is supplied in tape-and-reel (TR) format, enabling automated pick-and-place machine handling for high-volume SMT reflow assembly lines running at 260°C peak temperature, reducing manual placement errors across 38 positions.
In which embedded or industrial applications is the TSM-119-03-H-DH-A-K-TR most commonly used?
This terminal strip is commonly deployed in SBC expansion headers, FPGA development boards, industrial I/O controllers, and test fixtures where 38 dual-row positions at 0.100 inch pitch provide sufficient signal density for data buses operating at 3.3 V to 5 V logic levels.
How does the TSM-119-03-H-DH-A-K-TR compare to single-row alternatives with the same total pin count?
Compared to a single-row 38-position strip at 0.100 inch pitch (occupying 3.8 inches of board edge), the dual-row TSM-119-03-H-DH-A-K-TR requires only 1.9 inches of board length, saving approximately 50% of PCB real estate while maintaining the same 38-pin capacity.
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