TSM-118-04-SM-DH-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-118-04-SM-DH-P-TR is a 36-position, dual-row .100" (2.54 mm) pitch surface-mount terminal strip connector. Features gold-plated contacts, shrouded dual-row configuration, and tape-and-reel packaging for automated PCB assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 36
- Lifecycle
- ACTIVE
- Datasheet
- TSM-118-04-SM-DH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 36-position dual-row .100" (2.54 mm) pitch surface-mount terminal strip
- Gold-plated contacts for reliable low-resistance connections
- Tape-and-reel packaging for automated SMT assembly lines
- Shrouded design providing mechanical keying and mating alignment
- RoHS-compliant construction suitable for lead-free solder processes
Applications
The TSM-118-04-SM-DH-P-TR is widely used in board-to-board and board-to-wire interconnect applications in industrial equipment, test and measurement systems, and embedded computing platforms. Its surface-mount dual-row format with 2.54 mm pitch makes it ideal for backplane connectors, daughtercard interfaces, and high-density signal routing in compact PCB designs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-118-04-SM-DH-P-TR have, and what is its pitch?
The TSM-118-04-SM-DH-P-TR is a 36-position dual-row terminal strip with a standard .100" (2.54 mm) pitch, providing 18 positions per row for high-density signal connections on SMT-compatible PCBs.
Which PCB assembly processes are compatible with the TSM-118-04-SM-DH-P-TR's packaging format?
Supplied in tape-and-reel format (TR suffix), this connector is optimized for automated pick-and-place SMT assembly. The surface-mount termination style supports reflow soldering with standard 2.54 mm pitch land patterns, reducing manual placement labor in production runs.
When should a designer choose TSM-118-04-SM-DH-P-TR over a through-hole dual-row header for backplane interconnects?
For low-profile PCB stacking or high-volume automated assembly, the surface-mount TSM-118-04-SM-DH-P-TR is preferred because it eliminates 2.54 mm through-hole drilling, saves board thickness, and integrates with reflow processes delivering contact resistance typically below 20 mΩ.
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