TSM-115-03-LM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-115-03-LM-DH-A-K-TR is a 30-position, dual-row, 0.100" pitch surface mount terminal strip with dual-height profile and tape-and-reel packaging. Offers gold-plated contacts for reliable SMT board-to-board interconnection in standard 2.54 mm pitch designs. Available from authorized global distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 30
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 30-position dual-row 0.100" (2.54 mm) pitch for compatibility with standard PCB grid layouts and legacy designs
- Dual-height (DH) insulator body providing additional board clearance for tall components in stacked PCB assemblies
- Tape-and-reel (TR) packaging enabling high-volume automated pick-and-place SMT assembly
- Gold-plated contacts ensuring low contact resistance and long-term mating reliability across multiple insertion cycles
Applications
The TSM-115-03-LM-DH-A-K-TR is used in industrial control panels, embedded computing modules, and power distribution boards where 30 signal or power positions must be connected at the standard 0.100" (2.54 mm) pitch. Its dual-height design accommodates components protruding above the PCB surface in board stacking configurations, making it suitable for backplane and daughtercard interconnects. The tape-and-reel packaging streamlines automated SMT production for high-volume electronics manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the TSM-115-03-LM-DH-A-K-TR provide, and how does this compare to 0.050" pitch alternatives?
The TSM-115-03-LM-DH-A-K-TR offers 30 positions on a 0.100" (2.54 mm) pitch dual-row layout, occupying approximately 38.1 mm of PCB length. Compared to 0.050" pitch alternatives like the SFM series, it provides twice the pin-to-pin spacing, which improves mechanical robustness and makes it easier to route wide traces between contacts, especially in power distribution designs.
What does the dual-height (DH) designation mean for TSM-115-03-LM-DH-A-K-TR in board stacking applications?
The dual-height (DH) designation indicates the TSM-115-03-LM-DH-A-K-TR has a taller insulator body, typically providing 3 mm to 5 mm of additional vertical clearance between stacked PCBs. This allows passive components, capacitors, or connectors up to that height to remain on the PCB surface without contacting the adjacent board in a stacked assembly.
Is the TSM-115-03-LM-DH-A-K-TR suitable for automated SMT production?
Yes, the TSM-115-03-LM-DH-A-K-TR ships in tape-and-reel (TR) format and is designed for surface mount technology (SMT) assembly, fully compatible with standard pick-and-place equipment and lead-free reflow profiles up to 260°C peak temperature. This makes it suitable for high-volume production runs where consistent, repeatable automated placement of all 30 positions is essential.
Which industrial applications benefit from the 30-position 0.100" pitch configuration of TSM-115-03-LM-DH-A-K-TR?
Industrial applications that benefit most include programmable logic controller (PLC) I/O boards, data acquisition modules with up to 15 differential input channels, and backplane interconnects in rack-mounted systems where the 0.100" (2.54 mm) pitch allows robust signal and power routing across 30 positions without the risk of solder bridging that a finer-pitch connector would present.
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