TSM-114-04-STL-DH-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-114-04-STL-DH-P-TR is a 28-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch in a low-profile through-lead (STL) configuration, supplied in tape-and-reel packaging for automated assembly. It features gold-plated contacts and dual-height keying for reliable board-to-board interconnects. In stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 28
- Lifecycle
- ACTIVE
- Datasheet
- TSM-114-04-STL-DH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 28 contacts in dual-row 0.100" (2.54 mm) pitch with through-lead (STL) termination for secure PCB footprint registration and solderability
- Dual-height (DH) configuration provides mechanical keying to prevent incorrect board orientation during stacked PCB assembly
- Gold-plated contact finish ensures low contact resistance and long insertion life in industrial and communications applications
- Tape-and-reel (TR) packaging with SMT-compatible footprint supports high-volume automated pick-and-place PCB assembly
Applications
The TSM-114-04-STL-DH-P-TR is used in board-to-board interconnect applications within embedded computing modules, industrial control cards, and test fixtures where 28 signal or power lines must be reliably connected at a standard 0.100" pitch. Its STL through-lead configuration and dual-height keying make it well suited for stacked PCB designs in telecom equipment, data acquisition systems, and ruggedized instrument daughter cards.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the STL suffix indicate about the TSM-114-04-STL-DH-P-TR termination style, and why does it matter for soldering?
The STL suffix designates a through-lead termination style, meaning the connector contacts extend through the PCB and are soldered on the opposite side rather than relying solely on surface pads. This through-lead design increases solder joint mechanical strength by approximately 3× compared to a pure SMT solder joint, making the TSM-114-04-STL-DH-P-TR more resistant to PCB flexure and vibration in ruggedized industrial and embedded computing applications where board stress is a concern.
How many positions does the TSM-114-04-STL-DH-P-TR provide, and how does that compare to the TSM-126 in the same family?
The TSM-114-04-STL-DH-P-TR provides 28 positions (14 per row) in a dual-row 0.100" pitch configuration, compared to 52 positions (26 per row) on the TSM-126. The TSM-114 body is correspondingly shorter—approximately 36.6 mm long versus 66.6 mm for the TSM-126—making it a better fit for applications where fewer than 30 signal lines are needed and board space or connector height along the edge of the PCB must be minimized.
Can TSM-114-04-STL-DH-P-TR be used to route both power and signal lines simultaneously?
Yes. SAMTEC TSM series terminal strips are rated at approximately 1 A per contact at 25°C ambient temperature, and with 28 contacts available, several adjacent pins can be ganged for higher-current power rails. For example, connecting 3 adjacent pins to a 3.3 V power rail allows up to 3 A of continuous load current within thermal derating limits, while the remaining 25 contacts carry digital signals at 0.1 A or less, enabling a single TSM-114 connector to serve as the sole board interconnect for a mixed power-and-signal mezzanine card.
Why does tape-and-reel packaging improve production yield for TSM-114-04-STL-DH-P-TR compared to loose bulk packaging?
Tape-and-reel packaging positions each 28-pin TSM-114-04-STL-DH-P-TR at a fixed orientation on a 24 mm or 32 mm carrier tape with a consistent pitch of 24 mm to 32 mm between parts, enabling automated pick-and-place machines to achieve placement accuracy within ±0.05 mm. Compared to loose bulk packaging where components may tangle or flip, tape-and-reel reduces placement defect rates in automated lines by over 90%, directly improving first-pass yield and reducing rework cost in high-volume PCB production.
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