TSM-114-03-T-DH-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-114-03-T-DH-P-TR is a 28-position dual-row surface mount terminal strip on 0.100-inch (2.54 mm) pitch with tape-and-reel delivery, suited for standard-pitch board-to-board and wire-to-board interconnects in automated SMT assembly environments.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 28
- Lifecycle
- ACTIVE
- Datasheet
- TSM-114-03-T-DH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 28-position dual-row configuration on 0.100-inch (2.54 mm) pitch ensuring universal compatibility with standard mating headers, IDC connectors, and jumpers
- Surface mount termination at up to 260 °C reflow temperature enabling cost-effective lead-free PCB assembly without through-hole drilling
- Tape-and-reel (TR) packaging for automated pick-and-place SMT lines, reducing hand-placement labor in high-volume production
Applications
The TSM-114-03-T-DH-P-TR is applied in prototyping boards, industrial automation controllers, and embedded system expansion cards where a reliable 28-position 0.100-inch pitch surface mount connector is required. Its dual-row layout delivers 28 circuits within a footprint approximately 1.35 inches long, facilitating compact I/O expansion on space-limited designs. The SMT format paired with tape-and-reel packaging optimizes throughput on automated assembly lines serving consumer, industrial, and IoT markets.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the dual-row layout of the TSM-114-03-T-DH-P-TR improve board space efficiency versus a single-row 28-pin connector?
The dual-row TSM-114-03-T-DH-P-TR carries 28 circuits in a footprint roughly 0.7 inches long, while a single-row 28-position connector at 0.100-inch pitch would require approximately 2.7 inches of linear board edge. This space saving of over 70% in length is critical in compact embedded systems and SBC shield designs.
What reflow temperature rating applies to the TSM-114-03-T-DH-P-TR for lead-free PCB assembly?
The TSM-114-03-T-DH-P-TR is rated for lead-free reflow soldering at peak temperatures up to 260 °C, consistent with IPC/JEDEC J-STD-020 requirements for SMT components. Its surface mount pads are compatible with standard SAC305 solder paste used in 0.100-inch pitch component assembly on FR4 and high-Tg PCB substrates.
Can the TSM-114-03-T-DH-P-TR mate with ribbon cable IDC connectors for wire-to-board applications?
Yes. The TSM-114-03-T-DH-P-TR's 28-position dual-row layout on 0.100-inch (2.54 mm) pitch is directly compatible with standard 28-way IDC ribbon cable connectors and box headers. This allows wire-to-board routing from flat cables in 28-channel data acquisition, sensor interface, and modular industrial control wiring harnesses.
When is TSM-114-03-T-DH-P-TR preferred over TSM-114-04-S-DH-P-TR in an SMT design?
The TSM-114-03-T-DH-P-TR and TSM-114-04-S-DH-P-TR both offer 28 positions on 0.100-inch pitch, but differ in post height and tail style. The -03 variant's shorter profile suits low-clearance stacked board designs where board separation is under 8 mm, while the -04 variant suits taller stack heights. Selecting -03 reduces overall assembly height by approximately 1 to 2 mm.
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