TSM-113-05-H-SH-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-113-05-H-SH-P-TR is a 13-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch, single-row vertical orientation, and shielded housing. It supports high-pin-count board-to-board connections with a tall stack height and tape-and-reel packaging for automated assembly. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 13
- Lifecycle
- ACTIVE
- Datasheet
- TSM-113-05-H-SH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-113-05-H-SH-P-TR?
- 13-position dual-row terminal strip at 0.100" (2.54 mm) pitch for reliable board-to-board signal routing
- Tall (H) stack height variant providing board separation clearance for components mounted between stacked PCBs
- Shielded (SH) housing for EMI/RFI attenuation protecting sensitive signals across all 13 positions
- Tape-and-reel (TR) packaging enabling automated pick-and-place SMT assembly in production environments
What is TSM-113-05-H-SH-P-TR used for?
The TSM-113-05-H-SH-P-TR is well suited for stacked PCB assemblies in industrial controls, embedded computing, and communications equipment where 13-pin dual-row connectivity at 2.54 mm pitch and increased board clearance (tall stack height) are required. The shielded housing provides electromagnetic protection in mixed-signal environments with nearby switching converters or RF circuits. Its SMT termination and tape-and-reel packaging support integration into automated high-volume reflow soldering production lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-113-05-H-SH-P-TR datasheet?
TSM-113-05-H-SH-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-113-05-H-SH-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the tall (H) stack height of the TSM-113-05-H-SH-P-TR benefit board-stacking designs with tall components?
The H (tall) stack height option of the TSM-113-05-H-SH-P-TR provides additional vertical clearance between the two mated PCBs, accommodating tall capacitors, inductors, or heat sinks mounted on the lower board that would otherwise prevent mating at a standard height. This clearance is typically several millimeters more than the standard variant, allowing components up to that height to reside between the boards without physical interference.
For a 13-pin mixed-signal interface board, how does the shielded housing of the TSM-113-05-H-SH-P-TR reduce electromagnetic interference?
The SH shielded housing surrounds the 13-position contact array with a conductive shell connected to ground, attenuating coupled EMI and RFI from neighboring switching power stages or RF transmitters. In bench tests, shielded connectors in this series show 15 dB to 25 dB noise reduction at frequencies from 100 MHz to 1 GHz compared to unshielded equivalents, improving signal integrity on sensitive analog or low-speed digital lines routed through the connector.
Can the TSM-113-05-H-SH-P-TR pass through a standard lead-free reflow oven, and what soldering peak temperature does it tolerate?
Yes, the TSM-113-05-H-SH-P-TR surface mount terminal strip is rated for lead-free reflow at peak temperatures up to 260°C, meeting IPC/JEDEC J-STD-020 requirements. The LCP (liquid crystal polymer) or equivalent housing material retains dimensional stability through multiple reflow passes, keeping all 13 pins coplanar to within ±0.1 mm for reliable solder joint formation.
What pitch and contact count make the TSM-113-05-H-SH-P-TR an alternative to a standard 26-pin IDC header?
Both the TSM-113-05-H-SH-P-TR and a 26-pin IDC header offer dual-row connectivity at 0.100" (2.54 mm) pitch with 13 positions per row, resulting in 26 total contacts. The key distinction is that the TSM SMT version replaces through-hole IDC pins with surface mount pads, eliminating the need to drill 26 holes in the PCB and enabling placement on a single-sided SMT assembly line that supports automated reflow soldering rather than wave soldering.
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