TSM-113-04-SS-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-113-04-SS-DH-A-K-TR is a 26-position dual-row surface mount terminal strip with 2.54 mm (0.100 inch) pitch. Features stainless steel contacts and tape-and-reel packaging for automated assembly. In stock with worldwide shipping for industrial and embedded system applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 26
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-113-04-SS-DH-A-K-TR?
- 26-position dual-row surface mount terminal strip on 2.54 mm (0.100 inch) pitch for standard PCB grid compatibility
- Stainless steel contact material providing high corrosion resistance and extended service life in harsh environment applications
- Tape-and-reel (-TR) packaging enabling high-speed automated SMT pick-and-place assembly with minimal handling errors
- Dual-height (-DH) profile accommodating mating connectors with varying standoff requirements on stacked PCB assemblies
- RoHS-compliant materials meeting global electronics environmental regulations for industrial and commercial end products
What is TSM-113-04-SS-DH-A-K-TR used for?
The TSM-113-04-SS-DH-A-K-TR is used in embedded computing daughterboards, industrial sensor interfaces, and communication modules that require reliable 26-position board-to-board connections at 2.54 mm pitch via surface mount reflow. Its stainless steel contacts and dual-height body suit rugged environments where connector exposure to moisture or cleaning solvents is expected. Tape-and-reel availability makes it especially practical for automated high-volume PCB assembly lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-113-04-SS-DH-A-K-TR datasheet?
TSM-113-04-SS-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-113-04-SS-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 2.54 mm pitch of the TSM-113-04-SS-DH-A-K-TR compare to tighter-pitch alternatives for dense 26-pin layouts?
The TSM-113-04-SS-DH-A-K-TR uses a standard 2.54 mm (0.100 inch) pitch, which is wider than the 2.00 mm or 1.27 mm pitch found in tighter-pitch SAMTEC families. For 26-position applications where PCB space is constrained below roughly 35 mm row length, a 1.27 mm pitch alternative such as the SAMTEC HSEC series may be more appropriate, while the 2.54 mm pitch eases hand-soldering and inspection.
What assembly process is supported by the tape-and-reel (-TR) packaging of this terminal strip?
The -TR suffix indicates tape-and-reel packaging, which feeds the TSM-113-04-SS-DH-A-K-TR through standard SMT pick-and-place machines at reflow soldering temperatures typically up to 260°C peak. This eliminates manual placement errors across dual-row 26-pin footprints and supports production volumes of thousands of boards per shift in automated assembly lines.
In which industrial or embedded applications does the stainless steel contact material of the TSM-113-04-SS-DH-A-K-TR provide a reliability advantage?
Stainless steel contacts resist oxidation and corrosion in environments with humidity above 85% RH, salt spray, or exposure to industrial cleaning agents, making this terminal strip suitable for outdoor sensor nodes, factory automation controllers, and medical device PCBs that undergo repeated sterilization cycles. The material maintains contact force over millions of insertion cycles, unlike softer copper alloys that can yield under repeated mechanical stress.
How many total pins does the dual-row 13-column layout of the TSM-113-04-SS-DH-A-K-TR provide, and how should the PCB footprint be dimensioned?
The TSM-113-04-SS-DH-A-K-TR has 26 pins arranged in 2 rows of 13 columns on a 2.54 mm grid, requiring a PCB land pattern spanning approximately 30.5 mm in length and 2.54 mm between row centers. SMT pads should follow SAMTEC recommended dimensions to ensure adequate solder fillet formation during reflow and to meet IPC-A-610 Class 2 or Class 3 solder joint criteria.
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