TSM-113-04-H-DH-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-113-04-H-DH-P-TR is a 26-position, 0.100" (2.54 mm) pitch surface mount terminal strip in a dual-row through-hole compatible footprint. Rated for 3 A per contact with gold-plated contacts for reliable signal integrity. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 26
- Lifecycle
- ACTIVE
- Datasheet
- TSM-113-04-H-DH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-113-04-H-DH-P-TR?
- 26-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch for high-density board interconnects
- Gold-plated contacts rated at 3 A per pin ensuring low contact resistance and long-term signal reliability
- Tape-and-reel (TR) packaging supports high-volume automated SMT assembly with consistent pick-and-place placement
What is TSM-113-04-H-DH-P-TR used for?
The TSM-113-04-H-DH-P-TR is suited for backplane and board-to-board signal interconnects in industrial control, test and measurement equipment, and embedded computing platforms. Its surface mount form factor allows compact PCB designs where vertical clearance is limited. The tape-and-reel packaging makes it ideal for high-volume production lines using automated SMT assembly.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-113-04-H-DH-P-TR datasheet?
TSM-113-04-H-DH-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-113-04-H-DH-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact current rating and pitch of the TSM-113-04-H-DH-P-TR?
The TSM-113-04-H-DH-P-TR features a 0.100" (2.54 mm) pitch with contacts rated at 3 A per pin. The 26-position dual-row layout provides 13 pins per row, making it suitable for high-density signal distribution in compact PCB designs requiring reliable current handling.
Which PCB assembly processes are compatible with the TSM-113-04-H-DH-P-TR packaging?
The -TR suffix denotes tape-and-reel packaging, which is designed for automated SMT pick-and-place assembly. The reel format supports high-volume production runs and is compatible with standard surface mount reflow soldering processes used in industrial and consumer electronics manufacturing.
When should a designer choose the TSM-113-04-H-DH-P-TR over a through-hole terminal strip for board-level interconnects?
Designers should choose the surface mount TSM-113-04-H-DH-P-TR when PCB real estate is constrained and automated reflow assembly is preferred over manual through-hole soldering. The SMT format eliminates the need for drilled vias, reducing fabrication cost on 4-layer or 6-layer boards with tight via density limits. Its 3 A per contact rating is adequate for digital signal and low-power supply routing.
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