TSM-113-01-TL-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-113-01-TL-DH-A-K-TR is a 26-position dual-row surface mount terminal strip with 0.100 inch pitch, featuring top-loaded termination style for PCB interconnect applications. Supplied in tape-and-reel for automated assembly. Available in stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 26
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 26-position dual-row configuration at 0.100 inch (2.54 mm) pitch providing 13 pins per row for compact high-density PCB interconnects
- Top-loaded (TL) surface mount termination style enabling low-profile board-to-board or wire-to-board connections on space-constrained PCBs
- Tape-and-reel (TR) packaging ensuring seamless integration with automated SMT pick-and-place equipment for high-volume production
Applications
The SAMTEC TSM-113-01-TL-DH-A-K-TR is well-suited for general-purpose PCB interconnect applications in industrial control systems, communication modules, and embedded computing platforms requiring 26 reliable signal or power connections. Its 0.100 inch pitch dual-row layout maximizes contact density for module-to-motherboard connections and expansion interfaces. The tape-and-reel format and SMT termination support efficient high-volume automated assembly lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pin count and row configuration of the SAMTEC TSM-113-01-TL-DH-A-K-TR?
The TSM-113-01-TL-DH-A-K-TR is a 26-position dual-row terminal strip with 13 pins per row at 0.100 inch (2.54 mm) pitch. The dual-row configuration doubles the contact density compared to a single-row 26-pin header of the same length, making it ideal for board-to-board signal interfaces requiring compact footprints.
How does the top-loaded (TL) termination style of TSM-113-01-TL-DH-A-K-TR benefit PCB layout design?
The top-loaded surface mount termination style positions the solder contacts on the top side of the component, enabling a lower overall PCB assembly height compared to gull-wing or through-hole alternatives. This is advantageous for low-profile enclosure designs where vertical clearance is limited to less than 5 mm, while still providing reliable SMT solder joints compatible with standard reflow at 260°C peak temperature.
Which production environments are most suited to TSM-113-01-TL-DH-A-K-TR's tape-and-reel packaging?
The tape-and-reel (TR) format of TSM-113-01-TL-DH-A-K-TR is optimized for automated SMT pick-and-place lines running medium to high production volumes, typically 1000 or more assemblies per batch. Reel packaging reduces per-unit handling time, minimizes placement errors, and is compatible with standard EIA-481 tape widths used on most commercial SMT assembly equipment.
When is TSM-113-01-TL-DH-A-K-TR preferred over a 26-position single-row strip for module interconnect?
The dual-row configuration of TSM-113-01-TL-DH-A-K-TR occupies approximately half the linear PCB length of a single-row 26-position strip at the same 0.100 inch pitch, saving roughly 1.2 inches (30 mm) of board edge space. This makes it preferable when module connectors must fit within a constrained width, or when two signal groups need to be routed independently through adjacent rows to simplify PCB trace routing.
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