TSM-113-01-LM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-113-01-LM-DH-A-K-TR is a 26-position, 0.100" pitch dual-row low-profile surface mount terminal strip with keying for secure mating. Provides reliable PCB-to-module connections in compact embedded and industrial designs. Available in tape-and-reel packaging with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 26
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 26-position dual-row surface mount terminal strip at 0.100" (2.54 mm) pitch for medium-density PCB interconnects
- Low-profile mating height (LM) minimizes vertical board clearance requirements in stacked board assemblies
- Keying (K) and tape-and-reel (TR) options ensure error-proof mating and high-volume SMT production compatibility
Applications
The TSM-113-01-LM-DH-A-K-TR is designed for compact board-to-board and module-to-PCB interconnects in embedded computing, industrial control, and telecommunications equipment. With 26 positions at 0.100" pitch and a low-profile mating height, it accommodates tight board stack-ups while supporting 26 discrete signal or mixed-use connections. Its keying feature ensures repeatable and error-free installation in multi-header assemblies typical of PLC expansion modules and rack-mounted telecom cards.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pin count and pitch does the TSM-113-01-LM-DH-A-K-TR provide for PCB interconnects?
The TSM-113-01-LM-DH-A-K-TR features 26 total positions arranged in a dual-row configuration at 0.100" (2.54 mm) pitch, with 13 contacts per row. This layout suits medium-density signal routing applications such as PLC modules, embedded processor boards, and communication backplanes requiring reliable SMT connections.
For a stacked PCB assembly with tight clearances, how does the TSM-113-01-LM-DH-A-K-TR help minimize board spacing?
The low-profile mating height (LM suffix) of the TSM-113-01-LM-DH-A-K-TR reduces the board-to-board gap needed to accommodate the connector, enabling designs with minimal inter-board spacing of just a few millimeters. This is especially useful in compact rack enclosures and portable industrial instruments where 26-pin dual-row connectivity at 0.100" pitch must fit within strict vertical height budgets.
When should a designer choose the TSM-113-01-LM-DH-A-K-TR over an unkeyed 26-pin SMT header?
A designer should select the TSM-113-01-LM-DH-A-K-TR when the PCB layout includes multiple 26-pin or similarly-sized headers at 0.100" pitch positioned close together, increasing the risk of incorrect insertion during board assembly or field service. The K keying feature adds a physical lock that prevents mismating, reducing costly short-circuit events and rework in production lines processing hundreds of boards per day.
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