TSM-112-03-LM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-112-03-LM-DH-A-K-TR is a 24-position, 0.100" pitch dual-row low-profile surface mount terminal strip with keying feature for error-proof mating. Designed for reliable SMT daughter card interconnects in space-constrained PCB designs. Available in tape-and-reel packaging with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 24
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-112-03-LM-DH-A-K-TR?
- 24-position dual-row SMT terminal strip at 0.100" (2.54 mm) pitch with low mating height for compact board designs
- Keying (K) feature prevents connector mismating during assembly, reducing errors in multi-connector PCB layouts
- Tape-and-reel (TR) packaging optimized for automated pick-and-place SMT production lines
What is TSM-112-03-LM-DH-A-K-TR used for?
The TSM-112-03-LM-DH-A-K-TR is suited for low-profile daughter card connections, small form-factor embedded modules, and industrial sensor interface boards requiring reliable 24-pin dual-row SMT headers. Its keying feature ensures correct orientation during automated board assembly, especially valuable in designs with multiple identical connectors at 0.100" pitch. The low-profile mating height accommodates tight board-to-board clearances in stacked PCB configurations.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-112-03-LM-DH-A-K-TR datasheet?
TSM-112-03-LM-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-112-03-LM-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the total contact count and pitch of the TSM-112-03-LM-DH-A-K-TR?
The TSM-112-03-LM-DH-A-K-TR is a 24-position connector with 12 contacts per row in a dual-row configuration at 0.100" (2.54 mm) pitch. This layout supports 24 discrete signal or power connections and is widely compatible with standard PCB pad grids used in embedded computing and industrial applications.
How does the low-profile (LM) mating height of the TSM-112-03-LM-DH-A-K-TR help in stacked PCB designs?
The low-profile mating height variant of the TSM-112-03-LM-DH-A-K-TR reduces the vertical clearance required between stacked PCBs, enabling board-to-board gaps as small as a few millimeters. This is critical in compact embedded modules, stackable microcontroller boards, and portable instrumentation where overall product thickness must be minimized while maintaining 24 signal connections at 0.100" pitch.
Can the TSM-112-03-LM-DH-A-K-TR be mated with non-keyed TSM-series headers?
The K suffix on the TSM-112-03-LM-DH-A-K-TR indicates a keyed housing that is physically incompatible with non-keyed connectors of the same 0.100" pitch family. This design choice prevents incorrect mating on boards where multiple 24-position headers are placed near each other, reducing PCB rework costs in production and field maintenance scenarios.
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