TSM-112-01-STL-DH-P-TR SAMTEC Connector (Other) In Stock
The SAMTEC TSM-112-01-STL-DH-P-TR is a 24-position, 0.100 inch pitch surface mount terminal strip with dual-row through-hole design and tape-and-reel packaging. Supports reliable SMT assembly with a compact standard-pitch layout. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 24
- Lifecycle
- ACTIVE
- Datasheet
- TSM-112-01-STL-DH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 24-position surface mount terminal strip at 0.100 inch (2.54 mm) pitch for high-capacity signal routing on standard PCB grids
- Tape-and-reel (TR) packaging enables high-volume automated pick-and-place assembly for production-grade manufacturing
- Dual-row through-hole post design provides mechanical stability and secure board retention in demanding connector applications
Applications
The TSM-112-01-STL-DH-P-TR is designed for high-density interconnect applications in embedded systems, industrial automation, and telecommunications equipment requiring 24-position SMT terminal connections at 0.100 inch pitch. Its tape-and-reel packaging supports high-volume production lines with automated placement, reducing assembly time and improving consistency. This terminal strip suits backplane interfaces, development boards, and modular expansion connectors where standard 2.54 mm pitch wiring is needed.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch does the SAMTEC TSM-112-01-STL-DH-P-TR terminal strip support?
The TSM-112-01-STL-DH-P-TR provides 24 positions at a standard 0.100 inch (2.54 mm) pitch. This dual-row configuration supports high signal density and is compatible with standard ribbon cables, IDC connectors, and PCB grids used across embedded systems and industrial control applications.
Is the TSM-112-01-STL-DH-P-TR compatible with automated reel-to-reel production assembly?
Yes, the TSM-112-01-STL-DH-P-TR includes tape-and-reel (TR) packaging specifically designed for automated pick-and-place assembly equipment. The 24-position SMT footprint at 0.100 inch pitch supports standard reflow solder processes, making it suitable for high-volume PCB production lines with minimal manual handling.
What makes the TSM-112-01-STL-DH-P-TR suitable for backplane and expansion board designs?
The 24-position dual-row layout at 0.100 inch pitch provides sufficient signal capacity for backplane interfaces and modular expansion connectors in embedded systems. The through-hole dual-row post (DH) design offers enhanced mechanical retention, with the SMT base enabling board-level integration without requiring additional PCB drilling.
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