TSM-112-01-STL-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-112-01-STL-DH-A-K-TR is a 24-position dual-row surface-mount terminal strip at 0.100" (2.54 mm) pitch with a right-angle or dual-height configuration and locking features for secure SMD board interconnects. It combines standard 2.54 mm pitch compatibility with a robust locking design for industrial and embedded module interfaces. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 24
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 24-position dual-row SMD terminal strip at 0.100" (2.54 mm) pitch for broad mating connector compatibility
- Locking (-K) feature ensuring positive retention of the mated connector against vibration and cable pull forces
- Dual-height (-DH) body configuration supporting board stacking at defined standoff heights in compact enclosures
- Tape-and-reel (-TR) packaging enabling automated pick-and-place SMD assembly for volume production runs
Applications
The TSM-112-01-STL-DH-A-K-TR is used in embedded computing module interfaces, industrial PLC expansion boards, and SOM carrier card connectors where 24 SMD contacts at 0.100" pitch with locking retention are required. Its dual-height body supports controlled-standoff board stacking configurations in chassis-mounted assemblies subject to vibration. The tape-and-reel packaging makes it suitable for high-throughput automated PCB assembly in consumer electronics, automation equipment, and embedded Linux board designs requiring secure 24-pin board-to-board or board-to-cable connections.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the locking (-K) feature of the TSM-112-01-STL-DH-A-K-TR provide for board-to-board connections?
The locking (-K) suffix on the TSM-112-01-STL-DH-A-K-TR indicates a positive retention latch that prevents the mating connector from disengaging under cable tension or vibration. This is especially important in industrial automation and vehicle-mounted boards where 24-position connectors at 0.100" pitch must maintain reliable electrical contact across mechanical shock profiles exceeding 10 g or in environments with continuous low-frequency vibration.
How does the dual-height (-DH) body of the TSM-112-01-STL-DH-A-K-TR support PCB stacking designs?
The dual-height body provides a defined mechanical standoff between the two PCBs in a stacked assembly, allowing controlled board-to-board spacing without additional hardware. For embedded computing modules stacked above a carrier board, this dual-height configuration at 0.100" pitch ensures consistent air-gap clearance of several millimeters between board surfaces, facilitating thermal management and preventing component interference across 24-pin interfaces.
Is the TSM-112-01-STL-DH-A-K-TR compatible with standard 0.100" pitch IDC ribbon cable connectors?
Yes, the TSM-112-01-STL-DH-A-K-TR uses the industry-standard 0.100" (2.54 mm) pitch, which is fully compatible with IDC ribbon cable connectors, standard dual-row headers, and crimp housing assemblies commonly available across multiple connector manufacturers. This ensures engineers can source mating cables from a broad supply base without custom tooling, reducing bill-of-material costs for 24-position interface designs.
What production assembly advantages does the -TR tape-and-reel packaging of the TSM-112-01-STL-DH-A-K-TR offer?
Tape-and-reel packaging allows the TSM-112-01-STL-DH-A-K-TR to be fed directly into automated SMD pick-and-place machines, eliminating manual connector insertion steps that slow production and increase placement error rates. For volume PCB builds of 1,000 or more units, automated placement of the 24-position dual-row SMD terminal strip reduces per-unit assembly time and ensures consistent solder paste coverage and reflow quality across the full connector footprint.
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