TSM-112-01-SM-SH-A SAMTEC Connector (Other) In Stock
SAMTEC TSM-112-01-SM-SH-A is a 12-position dual-row 0.100" pitch surface-mount terminal strip with horizontal single-row orientation, gold-plated mating contacts, and peg board mounting for accurate PCB placement. From $1.50 in stock, worldwide shipping available.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 12
- Lifecycle
- ACTIVE
- Datasheet
- TSM-112-01-SM-SH-A Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 12-position dual-row configuration at 0.100" (2.54mm) pitch delivers versatile surface-mount board connector in standard footprint
- Gold-plated mating contacts with nickel barrier and tin termination provide low contact resistance and corrosion protection
- Peg board mounting option enables precise PCB positioning and eliminates connector shift during SMT reflow soldering
Applications
The TSM-112-01-SM-SH-A is ideal for board-to-board or board-to-cable interconnects in embedded systems, test and measurement instruments, and industrial I/O modules that require a surface-mount 0.100" pitch connector in a horizontal orientation. Its 12-position dual-row layout supports up to 12 signals or 6 differential pairs, covering UART, SPI, I2C, and analog sensor buses. The gold-plated contacts and peg mounting ensure consistent electrical performance and mechanical alignment through automated SMT assembly and repeated mating cycles.
Specifications
| YTEOL | 9.1 |
| Board Mounting Option | PEG |
| Body Breadth | 0.12inch |
| Body Depth | 0.28inch |
| Body Length | 1.2inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mixed Contacts | NO |
| Mounting Style | RIGHT ANGLE |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 1 |
| Number of Rows Loaded | 1 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| Rated Current (Signal) | 7A |
| Terminal Pitch | 2.54mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 12 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the peg mounting option on the TSM-112-01-SM-SH-A improve SMT assembly accuracy?
The TSM-112-01-SM-SH-A includes plastic peg feet that locate into corresponding PCB holes, mechanically anchoring the connector body during reflow soldering. This prevents lateral movement or tombstoning when solder paste liquefies at temperatures above 183°C, ensuring all 12-position contacts land precisely on their pads and eliminating rework caused by connector drift on the 0.100" pitch footprint.
What signal capacity does the 12-position dual-row TSM-112-01-SM-SH-A provide for embedded interface designs?
The TSM-112-01-SM-SH-A provides 12 contacts arranged in a dual-row 0.100" pitch pattern, accommodating 12 single-ended signals or 6 differential pairs within a 1.2-inch body length. This capacity comfortably supports SPI (4 signals), I2C (2 signals), dual UART (4 signals), or a combination of power, ground, and data lines for sensor modules and embedded debug interfaces.
For which board-to-board stacking scenarios is the horizontal single-row orientation of the TSM-112-01-SM-SH-A preferred?
The horizontal (SH) single-row orientation places the mating interface parallel to the PCB surface, making the TSM-112-01-SM-SH-A ideal for edge-card connections, side-entry cable harnesses, and low-profile stacking arrangements where total assembly height must remain below 8mm. This contrasts with vertical connectors that add height above the board, enabling compact enclosure designs for IoT gateways, industrial sensors, and portable medical devices.
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