TSM-112-01-L-SH SAMTEC Connector (Other) In Stock
SAMTEC TSM-112-01-L-SH is a 12-position dual-row surface mount terminal strip at 0.100 inch pitch with gold-over-nickel contact finish, measuring 1.2 inch body length. Designed for reliable board-to-board connectivity in compact electronic assemblies.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 12
- Lifecycle
- ACTIVE
- Datasheet
- TSM-112-01-L-SH Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 12-position dual-row terminal strip at 0.100 inch pitch for high-density board connections
- Gold (10 µin) over nickel (50 µin) contact finish for low-resistance, corrosion-resistant mating
- Surface mount with PEG board mounting option for secure mechanical attachment
- 1.2 inch body length supports compact interconnect layouts in space-constrained designs
Applications
The TSM-112-01-L-SH is used in PCB-to-PCB and module-to-baseboard interconnect applications in test equipment, industrial controllers, and embedded computing systems where 24 contacts are needed in a compact 0.100 inch pitch footprint. Its gold-plated contacts ensure reliable signal integrity across thousands of mating cycles in high-reliability environments. The dual-row surface-mount design simplifies automated PCB assembly and reduces board area compared to through-hole alternatives.
Specifications
| Pbfree Code | Yes |
| YTEOL | 9.1 |
| Board Mounting Option | PEG |
| Body Breadth | 0.12inch |
| Body Depth | 0.28inch |
| Body Length | 1.2inch |
| Connector Type | BOARD CONNECTOR |
| Contact Design | PREASSEM CONN |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | RIGHT ANGLE |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 1 |
| Number of Rows Loaded | 1 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| Plating Thickness | 10u inch |
| Rated Current (Signal) | 7A |
| Reference Standard | CSA; UL |
| Terminal Pitch | 2.54mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 12 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish does the TSM-112-01-L-SH use, and how does it affect connector reliability over many mating cycles?
The TSM-112-01-L-SH features gold (10 µin) over nickel (50 µin) contact finish on the mating interface, providing low contact resistance and excellent corrosion resistance. This finish maintains reliable electrical performance over thousands of mating cycles, making it suitable for test fixtures and field-replaceable module applications at 0.100 inch pitch.
For a dual-row PCB interconnect needing 24 signals at 0.100 inch pitch, how does the TSM-112-01-L-SH compare to single-row alternatives?
The TSM-112-01-L-SH packs 12 positions per row in 2 rows within a 1.2 inch body length, achieving 24 total contacts in roughly half the linear board space of a single-row 24-pin strip at 0.100 inch pitch. This dual-row configuration is ideal for dense signal or power distribution buses in compact embedded modules.
Which mounting options does the TSM-112-01-L-SH offer, and how do they benefit automated PCB assembly?
The TSM-112-01-L-SH supports a PEG board mounting option that locks the connector body to the PCB prior to soldering, holding it within ±0.1 mm positional tolerance during reflow. This prevents connector shifting in automated surface mount assembly lines, reducing defects on 0.100 inch pitch footprints in high-volume production.
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