TSM-111-05-H-SH SAMTEC Connector (Other) In Stock
SAMTEC TSM-111-05-H-SH is an 11-position single-row vertical surface mount terminal strip with 2.54 mm (.100") pitch in a shrouded housing configuration. It provides reliable SMT connectivity for PCB edge headers, evaluation boards, and embedded module interfaces requiring low pin-count vertical interconnect with shroud protection.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 11
- Lifecycle
- ACTIVE
- Datasheet
- TSM-111-05-H-SH Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-111-05-H-SH?
- 11-position single-row vertical SMT terminal strip on 2.54 mm (.100") pitch for compact PCB edge connections
- Shrouded housing (SH) guides mating connector during insertion, reducing risk of pin damage in field applications
- Surface mount termination compatible with standard SMT reflow soldering at peak temperatures up to 260°C
- Low-profile vertical orientation minimizes connector height above PCB for space-constrained enclosures
What is TSM-111-05-H-SH used for?
The TSM-111-05-H-SH is suitable for evaluation boards, embedded module breakout headers, and industrial sensor interface PCBs requiring 11-position vertical SMT connectivity at 2.54 mm pitch. Its shrouded housing protects contact pins during repeated mating cycles in field-serviced equipment and laboratory test fixtures. This connector also fits consumer electronics prototyping and FPGA development boards where compact single-row vertical headers are preferred.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-111-05-H-SH datasheet?
TSM-111-05-H-SH Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-111-05-H-SH?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the shrouded housing on the TSM-111-05-H-SH offer over open-pin strip connectors?
The shroud on the TSM-111-05-H-SH guides the mating connector into correct alignment, protecting the 11 contact pins from bending during blind-mate insertions in tight enclosures; it also reduces mis-mating probability in field-serviced equipment subjected to vibration up to 15g, improving long-term reliability.
For which vertical height-constrained PCB layouts is the TSM-111-05-H-SH best suited?
With its single-row vertical SMT footprint on a 2.54 mm pitch, the TSM-111-05-H-SH fits PCB assemblies requiring headers under 8 mm in total height; it is commonly selected for slim handheld instruments, battery management module interfaces, and compact sensor breakout boards where board-to-board clearance is under 10 mm.
How does the TSM-111-05-H-SH compare to a through-hole equivalent for automated SMT assembly?
The TSM-111-05-H-SH's SMT pads integrate directly into reflow soldering at 250°C to 260°C peak profiles without a secondary wave-solder step needed for through-hole alternatives; this reduces assembly cycle time, lowers per-board labor cost, and keeps the 11-pin connector on the same pick-and-place program as surrounding SMT components.
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