TSM-111-04-SS-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-111-04-SS-DH-A-K-TR is a 22-position surface-mount terminal strip with 0.100" (2.54 mm) pitch in a dual-height single-strip configuration. Designed for reliable signal and power connections on compact SMD PCBs. Available from stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 22
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 22-position single-row layout on 0.100" (2.54 mm) pitch suits standard header mating systems
- Surface-mount dual-height body accommodates stacked PCB configurations with controlled board-to-board spacing
- Tape-and-reel packaging (TR) supports high-volume automated pick-and-place assembly processes
Applications
The TSM-111-04-SS-DH-A-K-TR is suited for compact surface-mount PCB assemblies in embedded microcontroller systems, sensor interface boards, and development platforms that require 22-position connectivity at standard 0.100" pitch. Its dual-height body allows daughter boards to stack above the main PCB with adequate clearance for components. The tape-and-reel packaging ensures compatibility with automated SMT production lines in medium-to-high volume manufacturing environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What position count and pitch does the TSM-111-04-SS-DH-A-K-TR offer for surface-mount signal interfaces?
The TSM-111-04-SS-DH-A-K-TR provides 22 positions on a 0.100" (2.54 mm) pitch. This standard spacing is compatible with a wide range of SAMTEC and industry-standard mating headers, making it easy to source matching connectors for prototype and production designs.
How does the dual-height body of the TSM-111-04-SS-DH-A-K-TR benefit stacked PCB designs?
The dual-height body increases the stand-off distance between the main board and daughter card, providing clearance for surface-mounted components up to several millimeters tall. This is valuable in 22-position stacked assemblies where through-hole or tall SMD parts beneath the daughter board would otherwise cause interference.
Which packaging format does the TSM-111-04-SS-DH-A-K-TR come in, and how does that affect procurement for high-volume production?
The -TR suffix designates tape-and-reel packaging, which feeds directly into automated SMT pick-and-place machines. For production runs of thousands of boards requiring 22-position terminal strips at 0.100" pitch, tape-and-reel minimizes per-part handling cost and reduces placement errors versus loose or tube packaging.
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