TSM-111-02-SM-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-111-02-SM-DH-A-K-TR is a 22-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch, featuring a dual-height profile and tape-and-reel packaging for automated assembly. Gold-plated contacts deliver reliable signal continuity across board-to-board interconnect applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 22
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 22-position dual-row SMT terminal strip at 0.100" (2.54 mm) pitch for standard grid board interconnect
- Dual-height (DH) profile allows mating with varying header heights in stacked PCB assemblies
- Tape-and-reel (TR) packaging supports high-speed automated pick-and-place assembly on production PCB lines
Applications
The TSM-111-02-SM-DH-A-K-TR is suited for signal and mixed power-signal routing on industrial control boards, embedded processor modules, and consumer electronics motherboards. Its 22-position dual-row layout at standard 2.54 mm pitch makes it interchangeable with common through-hole headers, simplifying design transitions to SMT. Tape-and-reel packaging supports efficient automated placement in medium-to-high-volume production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signals can the TSM-111-02-SM-DH-A-K-TR route and at what contact spacing?
The TSM-111-02-SM-DH-A-K-TR routes 22 signals in a dual-row configuration at 0.100" (2.54 mm) pitch. This matches the industry-standard 2.54 mm grid, ensuring wide compatibility with mating headers and PCB routing conventions used in embedded and industrial electronic designs.
What does the dual-height (DH) designation mean for board stacking with the TSM-111-02-SM-DH-A-K-TR?
The dual-height designation means the TSM-111-02-SM-DH-A-K-TR can engage mating pins of multiple heights, accommodating inter-board spacings that vary by several millimeters. This flexibility is valuable in stacked PCB assemblies where different modules require different board separation distances within the same enclosure.
Is the TSM-111-02-SM-DH-A-K-TR suitable for replacing through-hole headers in an SMT redesign?
Yes. The TSM-111-02-SM-DH-A-K-TR uses the standard 0.100" (2.54 mm) pitch and 22-position dual-row layout that directly mirrors common through-hole terminal strip footprints, making it a compatible drop-in for designs transitioning to surface mount reflow processes without changing the 2.54 mm grid PCB layout.
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