TSM-110-05-LM-SH SAMTEC Connector (Other) In Stock
SAMTEC TSM-110-05-LM-SH is a 10-position, 2.54 mm pitch surface mount terminal strip in a low-profile single-row vertical configuration with shell. Rated at 3 A per contact and 125 V AC/DC, it delivers dependable SMT connectivity for dense PCB layouts. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 10
- Lifecycle
- ACTIVE
- Datasheet
- TSM-110-05-LM-SH Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 10-position single-row vertical SMT footprint on a 2.54 mm (0.100 inch) pitch saves board space on dense PCBs
- 3 A / 125 V AC/DC per contact for reliable signal and low-power distribution in SMT assemblies
- Integrated shell (SH) option provides additional mechanical retention and EMI shielding over standard shell-less variants
Applications
TSM-110-05-LM-SH is used in industrial controllers, embedded system boards, and test-and-measurement modules where a compact 10-position SMT terminal strip is required on a 2.54 mm grid. The shelled single-row vertical design makes it easy to mate in constrained enclosure heights while maintaining solid mechanical retention.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What per-contact electrical rating does TSM-110-05-LM-SH support for PCB signal buses?
Each of the 10 contacts is rated for 3 A continuous current at 125 V AC/DC, which is adequate for signal and low-power bus distribution on surface-mount PCBs with a 2.54 mm pitch. This rating covers most embedded system and industrial control applications.
How does the shell (SH) option on TSM-110-05-LM-SH improve mechanical performance compared to shell-less variants?
The shell option surrounds the 10-pin SMT body to increase withdrawal force retention and provides a degree of EMI shielding. This lowers the chance of accidental unmating in vibration-prone environments like motor-control boards or automotive test fixtures, all while keeping the 0.100 inch pitch footprint unchanged.
Which board-to-wire or board-to-board applications suit the TSM-110-05-LM-SH single-row vertical configuration?
The vertical SMT single-row layout at 2.54 mm pitch is ideal for ribbon-cable termination, daughter-card edge connections, and debug header breakouts where height clearance is limited to under 8 mm. Applications include embedded development boards, JTAG/SWD programming headers, and compact sensor modules requiring 10 positions.
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