TSM-110-02-SS-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-110-02-SS-DH-A-P-TR is a 20-position dual-row surface mount terminal strip with 0.100" pitch and dual-height (DH) contact design, providing two selectable mating heights for flexible board-to-board stacking. Suited for cost-effective high-volume SMT assembly. Available in tape-and-reel packaging.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 20
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-110-02-SS-DH-A-P-TR?
- 20-position dual-row 0.100" pitch SMT terminal strip with dual-height (DH) contact option for flexible board stacking clearance
- Surface-mount solder tails enable co-planar reflow assembly compatible with standard automated SMT production workflows
- Tape-and-reel (TR) packaging ensures consistent pick-and-place orientation for high-volume manufacturing efficiency
What is TSM-110-02-SS-DH-A-P-TR used for?
The TSM-110-02-SS-DH-A-P-TR is used in dual-row board-to-board and board-to-module stacking connections in embedded computing, consumer electronics, and industrial control applications. Its 20-position 0.100" pitch dual-row layout provides a compact 10-column signal interface supporting up to 20 channels in a small PCB footprint. The dual-height contact design allows engineers to select the appropriate standoff height to match varying board separation requirements in stacked PCB assemblies.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-110-02-SS-DH-A-P-TR datasheet?
TSM-110-02-SS-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-110-02-SS-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the DH (dual-height) designation mean for TSM-110-02-SS-DH-A-P-TR, and how does it affect PCB stack design?
The DH designation indicates that the TSM-110-02-SS-DH-A-P-TR offers contacts at two selectable heights, typically 3 mm and 5 mm above the PCB surface. This allows the same connector to accommodate different board-to-board stacking distances, providing design flexibility when component height clearances on the intermediate PCB layer vary between 3 mm and 5 mm in a stacked module assembly.
For a 20-signal dual-row interconnect at 0.100" pitch, when is TSM-110-02-SS-DH-A-P-TR preferred over a single-row alternative?
The TSM-110-02-SS-DH-A-P-TR in dual-row configuration routes 20 signals in a footprint of only 10 column positions at 0.100" pitch, achieving roughly half the board-edge length compared to a 20-position single-row connector. This makes the dual-row design preferable when the PCB has limited board-edge real estate or when 20 signals must be routed through a connector measuring under 1 inch in length.
Which industries and system types commonly use the TSM-110-02-SS-DH-A-P-TR as a stacking interconnect?
The TSM-110-02-SS-DH-A-P-TR is commonly used in consumer electronics for display and sensor module interconnects, in industrial controllers for stacked I/O daughter cards, and in embedded computing platforms such as Arduino-compatible shields where 20-pin dual-row 0.100" pitch is a standard interface. Its SMT termination at peak reflow temperatures up to 260°C is compatible with standard lead-free soldering processes used across these industries.
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