TSM-110-02-H-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-110-02-H-DH-A-P-TR is a 20-position dual-row surface-mount terminal strip with 0.100 inch pitch, high-profile mating interface, and tape-and-reel packaging. Provides reliable SMT signal connections. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 20
- Lifecycle
- ACTIVE
- Datasheet
- TSM-110-02-H-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-110-02-H-DH-A-P-TR?
- 20-position dual-row SMT terminal strip on industry-standard 0.100 inch (2.54 mm) pitch ensures broad compatibility with standard 0.100 inch mating headers and breadboards
- High-profile (H) mating interface and double-height (DH) body allow visual inspection of pin alignment and accommodate thicker daughter-card PCBs up to 3.2 mm
- Tape-and-reel (TR) packaging enables automated pick-and-place SMT assembly at high volume production rates without manual loading
What is TSM-110-02-H-DH-A-P-TR used for?
The TSM-110-02-H-DH-A-P-TR serves as the female receptacle for 20-position dual-row 0.100 inch pitch pin headers in development boards, industrial controller modules, and instrumentation panels where standard pitch compatibility with third-party pin headers is required. Its high-profile double-height design accommodates stacked PCBs and daughtercard assemblies in embedded computing and test fixtures. The tape-and-reel packaging makes it suitable for automated SMT production lines processing thousands of boards per shift.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-110-02-H-DH-A-P-TR datasheet?
TSM-110-02-H-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-110-02-H-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the high-profile double-height body of the TSM-110-02-H-DH-A-P-TR affect daughtercard clearance compared to standard-profile TSM variants?
The high-profile (H) and double-height (DH) body of the TSM-110-02-H-DH-A-P-TR provides a mating pin insertion depth of approximately 5.84 mm (0.230 inch) versus 2.54 mm for standard-height TSM variants. This extra depth accommodates daughtercards up to 3.2 mm thick inserted into the mated assembly and creates 6 mm to 8 mm of clearance between the main board and the bottom of the daughtercard.
Is TSM-110-02-H-DH-A-P-TR compatible with standard 0.100 inch pin headers from other manufacturers?
Yes. The TSM-110-02-H-DH-A-P-TR is designed for the industry-standard 0.100 inch (2.54 mm) pitch grid with 10 positions per row (20 total), making it mechanically compatible with standard square-post pin headers from any manufacturer that follows the JEDEC MO-015 or equivalent dual-row 2.54 mm header specification. Contact diameter acceptance is typically 0.64 mm square or 0.76 mm round posts with 0.025 inch nominal pin size.
What production benefit does the tape-and-reel (-TR) option on TSM-110-02-H-DH-A-P-TR provide over bulk-packed versions?
The tape-and-reel (-TR) packaging orients and spaces each TSM-110-02-H-DH-A-P-TR connector at 12 mm intervals in standard 24 mm wide carrier tape, compatible with 0402-to-SOIC pick-and-place nozzles. This eliminates hand-loading, reduces per-board assembly time by 3 seconds to 5 seconds, and supports placement rates above 3000 components per hour on standard SMT lines, lowering assembly cost significantly at volumes above 500 boards per batch.
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