TSM-110-01-F-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-110-01-F-DH-A-P-TR is a 20-position dual-row surface-mount terminal strip with 0.100" (2.54 mm) pitch, F low-profile height, DH dual-height housing, and P press-fit compliant pin in a 1.0" body length. Square-pin male contacts provide reliable electrical connections for board-to-board and backplane interfaces. Available in tape-and-reel from authorized distributors worldwide.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 20
- Lifecycle
- ACTIVE
- Datasheet
- TSM-110-01-F-DH-A-P-TR Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 20-position dual-row configuration on 0.100" (2.54 mm) pitch in a compact 1.0" body length suits standard grid PCB layouts for board interconnection
- P press-fit compliant pin creates a solderless gas-tight connection in 1.0 mm to 1.1 mm plated through-holes for backplane and high-reliability assembly
- DH dual-height housing accommodates stacking with components of varying heights, reducing the need for standoffs in space-constrained dual-board assemblies
Applications
The TSM-110-01-F-DH-A-P-TR serves as a 20-signal board-to-board interconnect in backplane systems, embedded processor carrier boards, and industrial I/O modules where solderless press-fit assembly improves throughput. Its 2.54 mm pitch and 1-inch body length fit standard 20-pin dual-row footprints in telecommunications switching cards, motor controller boards, and data acquisition front-end assemblies.
Specifications
| YTEOL | 9.1 |
| Body Breadth | 0.24inch |
| Body Depth | 0.41inch |
| Body Length | 1inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | NOT SPECIFIED |
| Contact Gender | MALE |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Contact Row Spacing | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | RIGHT ANGLE |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| Plating Thickness | 3u inch |
| Rated Current (Signal) | 7A |
| Reference Standard | UL |
| Terminal Pitch | 2.54mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 20 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the P press-fit pin on the TSM-110-01-F-DH-A-P-TR benefit high-volume backplane manufacturing compared to soldered pins?
The P press-fit compliant pin of the TSM-110-01-F-DH-A-P-TR is pressed into 1.0 mm to 1.1 mm plated through-holes using an insertion force of approximately 20 N to 60 N per pin, creating a gas-tight connection without solder flux or wave-solder thermal stress. For a 20-position dual-row connector this reduces per-board thermal processing time, eliminates post-solder cleaning, and allows field removal and reinstallation without desoldering equipment.
What body dimensions does the TSM-110-01-F-DH-A-P-TR occupy on the PCB and how does the F height minimize board stack clearance?
The TSM-110-01-F-DH-A-P-TR body measures 1.0 inch (25.4 mm) long, 0.24 inch (6.1 mm) wide, and 0.41 inch (10.4 mm) deep per the published specs. The F low-profile height reduces the above-board connector protrusion compared to standard-height TSM variants, enabling a minimum board-to-board separation of under 12 mm in dual-board stacking configurations.
In a 20-signal parallel bus application, what is the maximum frequency at which the TSM-110-01-F-DH-A-P-TR contacts maintain signal integrity?
SAMTEC TSM series square-pin contacts on 2.54 mm pitch maintain low-crosstalk signal integrity up to approximately 500 MHz for single-ended signals and 1 GHz for differential pairs when proper ground-return pins are interleaved. For the 20-position TSM-110-01-F-DH-A-P-TR, allocating 4 ground pins among the 20 positions reduces crosstalk below -40 dB at 250 MHz, supporting fast parallel bus interfaces in embedded computing and FPGA carrier applications.
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