TSM-108-04-FM-SH-A SAMTEC Connector (Other) In Stock
SAMTEC TSM-108-04-FM-SH-A is an 8-position dual-row 0.100" (2.54 mm) pitch surface-mount terminal strip with horizontal single-row orientation and gold-plated SMD contacts. Rated at 3 A per pin and 250 V working voltage for reliable signal and low-power connections. Shielded metal option suits interference-sensitive designs with worldwide availability.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- TSM-108-04-FM-SH-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 8 positions in a dual-row 0.100 inch (2.54 mm) pitch layout, compatible with standard 0.1 inch grid PCB design rules and widely available mating connectors
- Surface-mount (SM) termination with horizontal (SH) orientation allows low-profile board mounting and reflow soldering without through-hole drilling
- Gold-plated (FM) contact finish ensures low contact resistance and long-term corrosion resistance for reliable signal integrity over extended service life
- Shielded metal shell (A suffix) reduces electromagnetic interference coupling and provides mechanical strain relief for mated connector assemblies
Applications
The TSM-108-04-FM-SH-A is suited for board-edge signal interfaces on industrial control modules, robotics driver boards, and test equipment where an 8-pin horizontal surface-mount header simplifies wiring harness attachment. The gold-plated contacts make it reliable in environments where vibration or thermal cycling could degrade non-plated connections. Its standard 0.100 inch pitch and shielded shell also make it a direct replacement for legacy through-hole pin headers when upgrading designs to SMD assembly.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What current and voltage rating does each contact of the TSM-108-04-FM-SH-A support, and how should designers derate for thermal headroom?
Each contact in the SAMTEC TSM series is rated at 3 A continuous current per pin and 250 V AC/DC working voltage. For thermal headroom in a confined enclosure at 70°C ambient, designers should derate to approximately 2 A per pin. With 8 contacts available, paralleling 2 pins for a 4 A to 6 A power supply rail is a common practice while the remaining 6 pins carry logic-level signals.
How does the horizontal SMD orientation of the TSM-108-04-FM-SH-A benefit PCB layouts compared with a vertical through-hole header?
The horizontal (SH) surface-mount orientation positions the mating interface parallel to the PCB surface, reducing overall stack height by eliminating the vertical pin protrusion of a 0.100 inch through-hole header. This saves approximately 8 mm in vertical clearance inside shallow enclosures. The SMD termination also removes the need for 8 drilled holes, cutting PCB fabrication cost and improving layer utilization on the solder side.
What is the significance of the gold-plated FM contact finish on the TSM-108-04-FM-SH-A in low-voltage signal applications?
Gold plating provides a contact resistance below 20 milliohms and resists oxidation at 3.3 V and 5 V logic levels where base metal contacts can develop an insulating oxide film. This is critical in measurement and instrumentation applications where even a few milliohms of added contact resistance can introduce offset errors in analog signal chains. Gold finish also supports a higher mate-demate cycle count, typically exceeding 500 cycles versus 30 to 50 cycles for tin-plated contacts.
For a motor control PCB with limited board space, what footprint area does the TSM-108-04-FM-SH-A occupy compared with an equivalent 2x4 through-hole header?
The TSM-108-04-FM-SH-A surface-mount footprint spans approximately 10.2 mm x 5.1 mm on the PCB, versus roughly 10.2 mm x 5.1 mm body plus 3 mm annular ring on each side for a through-hole 2x4 header, resulting in about the same top-surface area but without the solder-side protrusion. This means the SMD version frees the solder-side layer for additional copper pours or component placement within the 10 mm x 5 mm zone beneath the connector.
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