TSM-108-04-F-DH-A-K-TR SAMTEC Connector (Other) In Stock
TSM-108-04-F-DH-A-K-TR is a 16-position, 0.100 inch pitch dual-row surface-mount terminal strip from SAMTEC offering reliable board-to-board or wire-to-board signal connections. It features an SMD footprint compatible with automated assembly and reflow soldering processes. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- TSM-108-04-F-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-108-04-F-DH-A-K-TR?
- 16-position dual-row layout on 0.100 inch pitch providing high-density SMD signal connectivity
- Surface-mount termination enabling automated pick-and-place and reflow soldering for efficient production assembly
- SAMTEC TSM series construction with tape-and-reel (TR) packaging suited for high-volume SMD manufacturing lines
What is TSM-108-04-F-DH-A-K-TR used for?
TSM-108-04-F-DH-A-K-TR is designed for high-density board-to-board and signal interconnect applications in industrial control systems, test and measurement instruments, and embedded computing modules. Its 16-position dual-row layout on 0.100 inch centers enables routing of multiple digital, analog, or power signals through a single compact SMD footprint. The tape-and-reel packaging makes it practical for automated assembly in volume production of consumer and industrial electronics.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-108-04-F-DH-A-K-TR datasheet?
TSM-108-04-F-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-108-04-F-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does TSM-108-04-F-DH-A-K-TR provide and what row configuration does it use?
TSM-108-04-F-DH-A-K-TR offers 16 positions arranged in a dual-row configuration on a standard 0.100 inch (2.54 mm) pitch. This dual-row layout accommodates 8 positions per row, enabling routing of 16 individual signals or mixed signal and ground connections in a compact SMD footprint that suits dense PCB designs in embedded and industrial systems.
What assembly process is TSM-108-04-F-DH-A-K-TR optimized for, and how does tape-and-reel packaging help volume production?
TSM-108-04-F-DH-A-K-TR is an SMD component optimized for automated pick-and-place placement followed by reflow soldering at standard lead-free profiles peaking at approximately 260°C. The tape-and-reel (TR) packaging ensures consistent component orientation and spacing for feeders, reducing placement errors and enabling high-throughput SMT lines producing thousands of units per shift.
In what embedded computing or industrial applications does TSM-108-04-F-DH-A-K-TR serve as a board-to-board connector?
TSM-108-04-F-DH-A-K-TR is suited for SBC daughter card interfaces, FPGA expansion headers, and industrial I/O modules where 16 positions of 0.100 inch pitch connectivity are needed on a surface-mount PCB. It handles both digital bus signals and low-voltage power distribution, making it useful in automation controllers, sensor interface boards, and development kit expansion connectors carrying signals up to several hundred MHz.
How does SAMTEC's TSM series compare to through-hole terminal strips for applications requiring rework or field servicing?
SAMTEC TSM series SMD terminal strips like TSM-108-04-F-DH-A-K-TR are permanently soldered to the PCB and are not designed for field-serviceable wire insertion as through-hole barrier strips are. However, they offer lower PCB real estate consumption, support automated assembly at 0.100 inch pitch across 16 positions, and allow thinner PCB stackups compared to through-hole components requiring full barrel drill depth on 1.6 mm boards.
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