TSM-108-03-TL-DH-A-K-TR SAMTEC Connector (Other) In Stock
TSM-108-03-TL-DH-A-K-TR is a SAMTEC 16-position surface mount terminal strip at 0.100 inch (2.54 mm) pitch with a top-loading dual-height (DH) body and Pb-free (K) plating. Designed for compact SMT board-to-board or board-to-wire interfaces, it ships on tape-and-reel for automated pick-and-place assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 16-position SMT terminal strip at 0.100 inch (2.54 mm) pitch with compact dual-height (DH) body for flexible board-to-board stacking clearance in multi-board system assemblies
- Pb-free (K suffix) contact plating ensuring RoHS compliance and compatibility with lead-free reflow soldering profiles up to 260°C peak temperature
- Tape-and-reel (TR) packaging for automated SMT placement, eliminating manual connector loading and supporting high-throughput PCB assembly lines
Applications
The TSM-108-03-TL-DH-A-K-TR is deployed in compact embedded systems, sensor interface boards, and industrial controller modules that require a 16-position SMT terminal strip with dual-height clearance between mated boards. Its Pb-free construction makes it suitable for consumer electronics, IoT devices, and medical instrumentation products that must meet global RoHS and REACH requirements. The standard 0.100 inch pitch ensures broad compatibility with mating connectors across a wide range of SAMTEC and third-party header series.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the DH designation mean on TSM-108-03-TL-DH-A-K-TR, and how does dual-height affect board stack clearance?
The DH (dual-height) designation on TSM-108-03-TL-DH-A-K-TR refers to a connector body that accommodates two different mating heights or provides an elevated housing to increase the clearance between the host PCB and the mating card. This extra vertical space—typically a few millimeters beyond the standard single-height body—allows components taller than 3 mm to be placed on the host board underneath the stacked daughter card, which is important in dense multi-board modules with capacitors or inductors near the connector footprint.
For an IoT sensor board requiring only 12 active signals, how does TSM-108-03-TL-DH-A-K-TR's 16-position capacity provide design headroom?
With 16 positions at 0.100 inch (2.54 mm) pitch, TSM-108-03-TL-DH-A-K-TR provides 4 spare contacts beyond the 12 active signals, which can be assigned as dedicated ground returns to improve signal integrity or reserved for future I2C, SPI, or power expansion without a connector change. The 4 additional contacts add only about 10 mm to the connector body length, a modest footprint increase that pays off when future product variants need additional sensor channels or communication interfaces on the same board.
Is TSM-108-03-TL-DH-A-K-TR compatible with standard lead-free reflow soldering, and what peak temperature does the -K plating support?
Yes, the K suffix confirms Pb-free (lead-free) contact plating on TSM-108-03-TL-DH-A-K-TR, and SAMTEC TSM-series connectors are qualified for standard lead-free reflow soldering with a peak temperature of 260°C. This matches the SAC305 and SAC387 solder paste profiles used in most modern SMT production lines, ensuring the connector survives the reflow cycle without delamination of the housing or oxidation of the contact finish.
When should a designer choose TSM-108-03-TL-DH-A-K-TR over a through-hole 16-pin connector for the same interface?
TSM-108-03-TL-DH-A-K-TR is preferred when the PCB assembly process is fully SMT and adding a through-hole component would require a separate selective solder or hand-solder step, which adds cost and cycle time. For boards with double-sided SMT component placement, the surface mount body of the TSM series also avoids drilling 16 plated through-holes, preserving inner layer routing channels in the board stackup and reducing fabrication cost at 0.100 inch pitch for 16 or fewer positions.
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